Stress-released Si3N4 microresonator fabrication process for optical frequency comb

Liangsen Feng,Wei Li,Yudong Li,Shaowu Chen
DOI: https://doi.org/10.1117/12.2625861
2022-03-27
Abstract:Si3N4 microresonator have been recently widely used in various applications. Key factor of OFC generation is high Qfactor microresonator device and the precisely dispersion control of waveguides. In this paper, low-propagation-loss structure with precisely engineered dispersion properties has been illustrated to realize microresonator-based optical frequency combs operating in the dissipative Kerr soliton regime. We designed a ring with 100 GHz free spectrum range (FSR) with the size of the chip about 5 mm×5 mm. The improvement included that we adopted high temperature annealing to reduce absorption loss, we used metal as hard mask layer before ICP etching of the Si3N4 layer and we etched the Si3N4 layer after deposition of the SiO2 layer to expose the waveguide section. The high Q-factor device need low optical pump power, such as on-chip diode laser and thus realized integrated on-chip microresonator optical frequency comb which was compatible with CMOS and be successfully used in chip-based optical clock and other applications.
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