Efficiently Enhancing Low-dielectric Properties and Chemical Resistances of Addition-cure Liquid Silicone Rubber by Filling With Silicone-modified Eucommia Gum Nanofiller

Chaohua Li,Shengpei Su,Bikui Wang,Jijia Zhou
DOI: https://doi.org/10.21203/rs.3.rs-335738/v1
2021-03-30
Abstract:Abstract It is of great interest and remains a challenge to simultaneously improve the low-dielectric properties and chemical resistances of addition-cure liquid silicone rubber (ALSR). In this work, we proposed an efficient approach to address this issue by filling silicone-modified eucommia gum nanofiller (SEUG) into ALSR. By adding 5 wt% SEUG, the dielectric constant of the SEUG/ALSR composite rubber was significantly lower than that of neat ALSR both at 10 2 Hz, 10 3 Hz and 10 4 Hz. Simultaneously, the SEUG/ALSR composite rubber exhibited better mechanical and insulation properties than the neat ALSR after HCl, NaCl, and oil resistance tests. Our findings demonstrated the great potential for fabricating silicone rubber with low-dielectric properties and erosion resistance by the utilization natural biomass rubber material, endowing it with excellent mechanical performance and degradability.
What problem does this paper attempt to address?