Abstract:Low-voltage scanning electron microscopy (LV-SEM) with landing energies below 5 keV has been widely used due to its advantages in mitigating the damage and charging effects to a specimen and enhancing surface information due to small interaction volume of electrons inside a specimen. Additionally, for elemental analysis of the surfaces of bulk specimens with Auger electron spectroscopy (AES) or electron energy loss spectroscopy (EELS), ultra-high-vacuum (UHV) environment is essential to maintain clean surfaces without the absorption of gas molecules during the electron beam irradiation for the acquisition of spectral data. In this study, we propose the optimal design and condition of a conical Electrostatic Objective Lens (EOL) for a UHV LV-SEM to achieve the high spatial resolution and secondary electron (SE) detection efficiency. The EOL is composed of only the three electrodes (retarding, focusing and booster electrodes) and the insulators, which is suitable for maintaining a UHV environment with less out-gassing. The cone angle of the EOL is determined as 60° to integrate a spectrometer in the UHV LV-SEM and in a large size and a higher tilt angle of the sample. Through the optimization with the simulations, the EOL achieves the minimized spherical and chromatic aberration coefficients of 0.05 and 0.03 mm at the sample side, respectively, at the landing energy of 50 eV and the shortest working distance (WD) of 1 mm for high-resolution imaging. In addition, the probe diameter of the optimized EOL is 2.3 nm at 1 keV and 5.7 nm at 50 eV with a WD of 1 mm and a probe current of 10 pA, which are comparable to previously studied compound objective lenses with magnetic and electrostatic lenses. Using a longer WD of 4 mm for analysis, the probe diameter was 5.4 nm at 1 keV and the SE detection efficiency was 83.3 % owing to the separated scintillator detector structure from the booster electrode. These results imply that the optimized EOL has the potential to be applied to a high-performance UHV LV-SEM for the surface imaging and analysis with a simple system configuration.

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