Abstract:In a recent study of diffusional creep in polycrystalline thin films deposited on substrates, we have discovered a new class of defects called the grain boundary diffusion wedges (Gao et al., Acta Mat. 47, pp. 2865–2878, 1999). These diffusion wedges are formed by stress driven mass transport between the free surface of the film and the grain boundaries during the process of substrate-constrained grain boundary diffusion. The mathematical modeling involves solution of integro-differential equations representing a strong coupling between elasticity and diffusion. The solution can be decomposed into diffusional eigenmodes reminiscent of crack-like opening displacement along the grain boundary which leads to a singular stress field at the root of the grain boundary. We find that the theoretical analysis successfully explains the difference between the mechanical behaviors of passivated and unpassivated copper films during thermal cycling on a silicon substrate. An important implication of our theoretical analysis is that dislocations with Burgers vector parallel to the interface can be nucleated at the root of the grain boundary. This is a new dislocation mechanism in thin films which contrasts to the well known Mathews-Freund-Nix mechanism of threading dislocation propagation. Recent TEM experiments at the Max Planck Institute for Metals Research have shown that, while threading dislocations dominate in passivated metal films, parallel glide dislocations begin to dominate in unpassivated copper films with thickness below 400 nm. This is consistent with our theoretical predictions. We have developed large scale molecular dynamics simulations of grain boundary diffusion wedges to clarify the nucleation mechanisms of parallel glide in thin films. Such atomic scale simulations of thin film diffusion not only show results which are consistent with both continuum theoretical and experimental studies, but also revealed the atomic processes of dislocation nucleation, climb, glide and storage in grain boundaries. The study should have far reaching implications for modeling deformation and diffusion in micro- and nanostructured materials.

Intrinsic tensile stress and grain boundary formation during Volmer–Weber film growth

FORMATION OF CRACK-LIKE DIFFUSION WEDGES AND COMPRESSIVE STRESS EVOLUTION DURING THIN FILM GROWTH WITH INHOMOGENEOUS GRAIN BOUNDARY DIFFUSIVITY

Modeling metallic island coalescence stress via adhesive contact between surfaces

Real-time Intrinsic Stress Generation During Volmer–Weber Growth of Co by Electrochemical Deposition

Restructuring of emergent grain boundaries at free surfaces – an interplay between core stabilization and elastic stress generation

Confined Capillary Stresses During the Initial Growth of Thin Films on Amorphous Substrates

Emergent grain boundary phases in stressed polycrystalline thin films

Atomistic and Continuum Studies of Crack-Like Diffusion Wedges and Associated Dislocation Mechanisms in Thin Films on Substrates

Deformation and boundary motion analysis of a faceted twin grain boundary

A Three-Dimensional Concurrent Atomistic/continuum Analysis of an Epitaxially Strained Island

Atomistic and Continuum Studies of Diffusional Creep and Associated Dislocation Mechanisms in Thin Films on Substrates

Stresses at grain boundaries: The maximum incompatibility stress in an infinitely extended elastic bicrystal under uniaxial loading

Morphological instability, evolution, and scaling in strained epitaxial films: An amplitude equation analysis of the phase field crystal model

5542 - MULTI-SCALE MODELING OF DEFORMATION IN POLYCRYSTALLINE THIN METAL FILMS

Dependence of the Stresses on Grain Orientations in Hexagonal Films

Some general properties of stress-driven surface evolution in a heteroepitaxial thin film structure

Relaxation of biaxial tensile strain in ultrathin metallic films: Ductile void growth versus nanocrystalline domain formation

Intrinsic Stress in Evaporated Metal Films

Constrained Grain Boundary Diffusion in Thin Copper Films

Dependence of Stresses and Strain Energies on Grain Orientations in Fcc Metal Films