Abstract:The nanometer-thin silicate platelets (NSP) were prepared by exfoliating sodium silicate clays (Na+-MMT). The silanol groups on the edge of NSP were organically functionalized via covalent bonding with 3-aminopropyltriethoxysilane (APTES) through sol-gel reaction to generate the amine-functionalized NSP (NSP-amines). Moreover, the NSP-amines were further allowed to react with glycidyl methacrylate (GMA) through epoxy-ring opening reaction to afford the NSP with covalently bonded acrylates (NSP-acrylates). The blending of NSP-acrylate in an UV-curable resin afforded the coating films of improved hardness from 4H to 6H by loading only 0.5 wt% and to 8H by loading 1.0 wt% of NSP-acrylate. By comparison, blending NSP-amines instead of NSP-acrylates in thermal-curable epoxy resins improved the films’ hardness from HB to H, 2H, 3H, and 4H when loading 0.5 wt%, 1 wt%, 2 wt%, and 3 wt%, respectively. The reversed utilization of using NSP-acrylates in epoxy and NSP-amines in acrylate resin demonstrated the nanocomposites of less effect than the analogous examples. The NSP-amines and NSP-acrylates were characterized by 29Si solid-state NMR for the evidence of Si-O-R bonding and the organic fraction variation was studied by thermo-gravimetric analysis (TGA).Graphical abstractThe conventional method of fabricating nanocomposites by the dispersion technique was further advanced by the molecular bonding with nanoclays, which was exemplified by nanometer-thin silicate platelets (NSP) in tethering amine and acrylate monomers. The covalently bonded NSP-monomers participated the resin polymerization into the network matrices in molecular-level connection, and subsequently enhanced their physical properties such as hardness, transparency and scratch-free in film performances in epoxies and acrylate resins.

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