Multilayer Assemblies of Poly(4-Vinylpyridine) Bearing an Osmium Complex and Poly(acrylic Acid) Via Hydrogen Bonding

LY Wang,Y Fu,ZQ Wang,Y Wang,CQ Sun,YG Fan,X Zhang
DOI: https://doi.org/10.1002/(sici)1521-3935(19990601)200:6<1523::aid-macp1523>3.0.co;2-6
IF: 2.996
1999-01-01
Macromolecular Chemistry and Physics
Abstract:Poly(4-vinylpyridine) bearing an osmium complex was alternately assembled with poly(acrylic acid) on a gold substrate via hydrogen bonding. W-Vis spectra were used to monitor the assembling process. X-ray diffraction patterns and AFM images showed that the multilayer film is of high quality with low surface roughness. The properties of electrodes modified with such a film were characterized by means of cyclic voltammograms, which strongly depended on the architecture of the layered assembly.
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