Abstract:Layered, two-dimensional (2D) materials are promising for next-generation photonics devices. Typically, the thickness of mechanically cleaved flakes and chemical vapor deposited thin films is distributed randomly over a large area, where accurate identification of atomic layer numbers is time-consuming. Hyperspectral imaging microscopy yields spectral information that can be used to distinguish the spectral differences of varying thickness specimens. However, its spatial resolution is relatively low due to the spectral imaging nature. In this work, we present a 3D deep learning solution called DALM (deep-learning-enabled atomic layer mapping) to merge hyperspectral reflection images (high spectral resolution) and RGB images (high spatial resolution) for the identification and segmentation of MoS<sub>2</sub> flakes with mono-, bi-, tri-, and multilayer thicknesses. DALM is trained on a small set of labeled images, automatically predicts layer distributions and segments individual layers with high accuracy, and shows robustness to illumination and contrast variations. Further, we show its advantageous performance over the state-of-the-art model that is solely based on RGB microscope images. This AI-supported technique with high speed, spatial resolution, and accuracy allows for reliable computer-aided identification of atomically thin materials.The Supporting Information is available free of charge at <a class="ext-link" href="/doi/10.1021/acsnano.0c09685?goto=supporting-info">https://pubs.acs.org/doi/10.1021/acsnano.0c09685</a>.Photographs of the optical microscope and the hyperspectral imaging microscope for data acquisition; GUI for dual-modality image registration and layer subclass labeling; labeled data and pixels with different values showing different layer numbers; principle of image conversion from labeled data to one-hot images of different layer numbers; data dimension variation from raw data to data pairs suitable for network training; data augmentation of RGB images; dimension fusion strategy of DALM; optical RGB image, normalized hyperspectral images, and normalized spectra of one data pair for demonstration; training curves of both models; confusion matrix of the network prediction using a rough classification of different subclasses; component list of the hyperspectral imaging microscope (<a class="ext-link" href="/doi/suppl/10.1021/acsnano.0c09685/suppl_file/nn0c09685_si_001.pdf">PDF</a>)This article has not yet been cited by other publications.

Angstrom-accuracy multilayer thickness determination using optical metrology and machine learning

3-D NAND Oxide/Nitride Tier Stack Thickness and Zonal Measurements With Infrared Metrology

Thickness Determination of Ultrathin 2D Materials Empowered by Machine Learning Algorithms

Metrology Challenges in 3D NAND Flash Technical Development and Manufacturing

In-Situ Thickness Measurement of Die Silicon Using Voltage Imaging for Hardware Assurance

Machine learning Assists on High Aspect Ratio Slit Trench Etching in 3D NAND

A New Method for Measuring Multilayer Thickness Using a Chromatic Confocal Sensor

3D Deep Learning Enables Accurate Layer Mapping of 2D Materials

Thickness measurements and uncertainty evaluation of a multilayer thin-film sample using auxiliary single-layer samples

Multispectral Microscopic Multiplexed (3M) Imaging of Atomically‐Thin Crystals Using Deep Learning

Ellipsometric critical dimension metrology employing mid-infrared wavelengths for high-aspect-ratio channel hole module etch processes

Applying Machine Learning Models on Metrology Data for Predicting Device Electrical Performance

Machine-learning based methodologies for 3d x-ray measurement, characterization and optimization for buried structures in advanced ic packages

Machine-Learning-Enabled Fast Optical Identification and Characterization of 2D Materials

Microsphere-assisted hyperspectral imaging: super-resolution, non-destructive metrology for semiconductor devices

Depth estimation from a single SEM image using pixel-wise fine-tuning with multimodal data

Wafer-scale characterization for two-dimensional material layers

Element-specific, non-destructive profiling of layered heterostructures

In-Situ Thickness Measurement of Thin Deposited Layer on the Silicon Wafer Using Multi-Reflected Terahertz Electro-Magnetic Wave

Mueller matrix spectroscopy and physics-based machine learning for gate-all-around sheet-specific metrology

Robust Detection, Segmentation, and Metrology of High Bandwidth Memory 3D Scans Using an Improved Semi-Supervised Deep Learning Approach