Abstract:Efficient plug-flow electrochemical reactors are characterized by their ability to effectively convert species with significant ionic strength and/or with the assistance of a well-behaved electrolyte. Because of the classic electroconductivity requirement, electrochemical reactors are not particularly attractive options for applications with low-conductivity conditions, especially for low-pressure feeds. However, these reactors can still find application in dedicated processes such as ultra-clean water conditioning and biological-coupled separation systems. Consequently, a multi-physics model was developed using COMSOL Multiphysics to characterize different reactor-design conditions based on the Tertiary Current Distribution which accounts for the effects of expected variations in electrolyte composition and ionic strength on the electrochemical process, as well as solution resistance and electrode kinetics. The modelling framework presented here employs single-phase laminar fluid flow, the Nernst-Planck equation, the water-based electroneutrality condition, and concentration-dependent overpotentials. This investigation particularly explores the electrolysis process of "anodic dissolution," in which elemental species dissociate from the solid matrix of the electrode and enter the liquid phase of the electrolyte as soluble ions. The reactor configuration of interest has a rectangular parallel-electrode design and is operated galvanostatically. A series of parametric studies are carried out to inspect the response of the system when hydrodynamic, kinetic, and geometric conditions are changed. The parametric sweep resulted in variable effluent concentrations and system voltage, which reveal underlaying optimization patterns for electrode dissolution in low conductivity water.

Simulation of Leveling in Electrodeposition

Simulation of TSV Copper Electrodeposition Process with Additives

RETRACTED: Copper Electrodeposition in Through-Silicon Via under Galvanostatic Condition

Modeling the Copper Electrodeposition of Through-silicon-vias Corresponded to Linear Sweep Voltammetry

Effect of Additives on Shape Evolution During Electrodeposition

Modeling Electrode Shape Changes in Electrodeposition and Electrochemical Dissolution

Simulation of Shape Evolution during Electrodeposition of Copper in the Presence of Additive

Finite element modeling of silver electrodeposition for evaluation of thickness distribution on complex geometries

Theory and Atomistic Simulation of Electrodeposition

Curvature Enhanced Adsorbate Coverage Model for Electrodeposition

Modeling mass transfer limitations driven by electrowetting in electrochemical CO 2 reduction at silver gas diffusion electrodes

Simulations of transport regime in electrodeposition in different viscosity scenarios

Current Distribution at Electrode Surfaces As Simulated by Finite Element Method

Numerical analysis of electrodeposition in microcavities

Toward Quantitative Phase-field Modeling of Dendritic Electrodeposition

Voltage-dependent cluster expansion for electrified solid-liquid interfaces: Application to the electrochemical deposition of transition metals

Multiphysics Modeling of Electrode Dissolution Under Hydrodynamic Conditions in Low Conductivity Water

Linear stability analysis of transient electrodeposition in charged porous media: suppression of dendritic growth by surface conduction

Simulation of aluminium electrodeposition on complex geometry: Influence of input parameters and electrodeposition conditions

Simulating the Influence of Supporting Electrolyte Concentration on Copper Electrodeposition in Microvias

Modelling of coating thickness distribution on the edges of a moving cathode during electrogalvanizing