Strain Effects Around Planar Diffused Structures

J. M. Fairfield,G. H. Schwuttke
DOI: https://doi.org/10.1149/1.2411235
IF: 3.9
1968-01-01
Journal of The Electrochemical Society
Abstract:Dislocations have been found to extend for considerable distances outside of planar diffused structures in silicon and to affect the electrical properties of the diffused junctions. The mechanism of dislocation propagation outside of phosphorus‐diffused structures has been studied by x‐ray diffraction microscopy and other techniques. It is shown that these dislocations are propagated through an anomalously large compressive stress that results from large strains in some high‐concentration phosphorus‐diffused structures. These strains cannot be attributed to the residual effects of substitutional phosphorus atomic mismatch with the silicon lattice. The anomalous stress and dislocations usually appear after an oxidizing diffusion or drive‐in cycle at temperatures less than 1150°C. Also, the dislocations are much less likely to occur in (100) or (110) oriented surf aces as opposed to (111) surfaces.
electrochemistry,materials science, coatings & films
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