Abstract:Carbon nanotubes (CNT) are known to be materials with potential for manufacturing sub-20 nm high aspect ratio vertical interconnects in future microchips. In order to be successful with respect to contending against established tungsten or copper based interconnects, though, CNT must fulfil their promise of also providing low electrical resistance in integrated structures using scalable integration processes fully compatible with silicon technology. Hence, carefully engineered growth and integration solutions are required before we can fully exploit their potentialities. This work tackles the problem of optimizing a CNT integration process from the electrical perspective. The technique of measuring the CNT resistance as a function of the CNT length is here extended to CNT integrated in vertical contacts. This allows extracting the linear resistivity and the contact resistance of the CNT, two parameters to our knowledge never reported separately for vertical CNT contacts and which are of utmost importance, as they respectively measure the quality of the CNT and that of their metal contacts. The technique proposed allows electrically distinguishing the impact of each processing step individually on the CNT resistivity and the CNT contact resistance. Hence it constitutes a powerful technique for optimizing the process and developing CNT contacts of superior quality. This can be of relevant technological importance not only for interconnects but also for all those applications that rely on the electrical properties of CNT grown with a catalytic chemical vapor deposition method at low temperature.

Nanocarbon interconnects combining vertical CNT interconnects and horizontal graphene lines

Towards 3-D Carbon-Based Heterogeneous Interconnects

Carbon‐Based Interconnects for RF Nanoelectronics

Electrothermal Cosimulation of 3-D Carbon-Based Heterogeneous Interconnects

Electrical Modeling of Three-Dimensional Carbon-Based Heterogeneous Interconnects

3D Nanocarbon Interconnects

Nanocarbon Interconnects - from 1D to 3D

Modeling of carbon nanotube (CNT) interconnects

Modeling of Carbon Nanotube Interconnects and Comparative Analysis with Cu Interconnects

Modeling and Characterization of Carbon-Based Heterogeneous Interconnects for 3-D Ics

Synthesis and Interface Characterization of CNTs on Graphene.

Circuit Modeling and Performance Analysis of Multi-Walled Carbon Nanotube Interconnects

Comparative Study on Multilayer Graphene Nanoribbon (MLGNR) Interconnects

Mini-Review: Modeling and Performance Analysis of Nanocarbon Interconnects

Measuring the electrical resistivity and contact resistance of vertical carbon nanotube bundles for application as interconnects

Horizontally aligned carbon nanotube bundles for interconnect application: diameter-dependent contact resistance and mean free path

Carbon Nanotube with Chemically Bonded Graphene Leaves for Electronic and Optoelectronic Applications

Nanocarbon via interconnects

Carbon Nanotubes for Interconnect Applications

Contacts with Nanocarbon Structures in Flexible Electronics

Refractory Vertically Aligned Carbon Nanotube–Boron Nitride Nanocomposites for Scalable Electrical Anisotropic Interconnects