Influence of post-etch cleaning and silane heat treatment on resin bond strength to silica-based leucite: an in vitro study

Mohammad Q. Al Rifaiy
DOI: https://doi.org/10.1080/01694243.2016.1244037
IF: 2.431
2016-10-14
Journal of Adhesion Science and Technology
Abstract:Adhesive cementation of bonded all-ceramic restorations is critical for their long-term clinical performance. The objective of this study was to evaluate the role of post-etch cleaning (PEC) and silane heat treatment on the micro-tensile bond strength of silica-based leucite (SBLE) ceramic when bonded to composite resin. Twenty-four blocks of SBLE ceramic (HeraCeram Press®, Heraeus Kulzer GmbH Grüner Weg 11 63450 Hanau) were fabricated and bonding surfaces were etched using 9.5% hydrofluoric acid. Six experimental groups were made from the various surface treatment combinations including: PEC (37.5% phosphoric acid for 1 min, rinsed with water for 20 s and ultrasonic bath immersion), silane application and silane heat treatment (100 °C for 5 min). An adhesive resin and a light-cured restorative composite were used to bond the ceramic and composite resin blocks under standard conditions. Three hundred and sixty specimen sticks (8 × 1 mm²) were subjected to micro-tensile testing. The means of the micro-tensile bond strength (μ-TBS) were analysed with ANOVA and Tukey–Kramer multiple comparison test. The specimens tested were assessed for mode of failure using scanning electron microscopy. The highest μ-TBS value (38.25 ± 3.40 MPa) of the specimen was achieved by PEC and heated silane. PEC and silane application showed statistically significant improvements in the μ-TBS (p < 0.01). The mean maximum difference was due to PEC (18.91 ± 3.70 MPa). In the surface treatment of SBLE ceramics, PEC had the most significant factor which affected the μ-TBS of resin composite.
materials science, multidisciplinary,engineering, chemical,mechanics
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