Dielectric and thermal properties of composite radome material under accelerated aging: an experimental study

Imran Haider,Iftikhar Hussain Gul,Mutawara Mahmood Baig,Malik Adeel Umer
DOI: https://doi.org/10.1007/s10854-024-12098-2
2024-03-10
Journal of Materials Science Materials in Electronics
Abstract:This work aims at investigating the dielectric and thermal properties of silica fiber/epoxy(SiO 2 /E) composite radome material subjected to 30 days of accelerated hygrothermal aging at 5 °C, 50 °C, 70 °C, and 80 °C. X-ray diffraction showed a Bragg angle (2 θ ) from 20° to 22.5°, while no noticeable change was observed in the morphology of SiO 2 /E composite radome materials, except fewer microcracks were seen (SiO 2 /E (5) ) when exposed to 5 °C. Among the aged SiO 2 /E (5) , SiO 2 /E (50) , SiO 2 /E (70) , and SiO 2 /E (80) composite radome material samples small variation was observed in the electrical and thermal properties except for SiO 2 /E (5) , where the highest increment in dielectric constant ( Ɛ r ) was noticed from 3.95 to 4.01, dielectric loss ( δ ) from 0.045 to 0.051, and fractional transmission was degraded 10.5% from its initial value. For SiO 2 /E (5) composite radome material, the maximum moisture (1.83%) was absorbed in the traverse fiber direction, while the thermal expansion coefficient ( α ) declined from 5.83 × 10 −6 K −1 to 5.76 × 10 −6 K −1 , and thermal conductivity( k ) dropped from 0.399 to 0.394 Wm −1 K −1 . However, in the SiO 2 /E (80) composite radome material exposed to 80 °C, the thermal conductivity was raised to 0.409 Wm −1 K −1 , along with less thermal degradation (23.42% weight loss) than other SiO 2 /E composite radome material samples exposed to 5 °C, 50 °C, and 70 °C. However, the Ɛ r and δ of SiO 2 /E (5) (aged at 5 °C) were increased to 1.5% and 1.1.3%. It was interesting that hygrothermal accelerated aging from ambient to 80 °C did not bring any substantial change in dielectric and thermal properties of SiO 2 /E x composite radome material, which reveals its sustainable performance in long-term microelectronic applications.
engineering, electrical & electronic,materials science, multidisciplinary,physics, condensed matter, applied
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