Microstructure, hardness, electrical, and thermal conductivity of SZCN solder reinforced with TiO2 and ZrO2 nanoparticles fabricated by powder metallurgy method

M. M. Mousa,Moustafa M. Mohammed,Omyma A. El-Kady,H. S. Mohamed

DOI: https://doi.org/10.1007/s10854-024-12758-3

2024-06-14

Journal of Materials Science Materials in Electronics

Abstract:The microstructure and characterization of Sn–Zn–Cu–Ni (SZCN) solder alloy reinforced with TiO 2 and ZrO 2 nanoparticles (NPs) synthesized by powder metallurgy were investigated. Sn, Zn, Cu and Ni metallic powders were mixed mechanical by 10:1 ball to powder ratio with 300 rpm speed for 2 h. Then 0.5 wt% from nano ZrO 2 or TiO 2 was mixed by the same parameters with the mixed metal powder. The morphologies and microstructures development during the fabrication process was investigated by X-ray diffractometer (XRD), optical microscope (OM), and scanning electron microscope (SEM) with energy dispersive X-ray spectrometry (EDX). The results reveal an improved distribution of TiO 2 or ZrO 2 NPs in the SZCN matrix solder, which resulted in an improvement in its density. The analyses of microstructural demonstrated that the addition of TiO 2 or ZrO 2 NPs to SZCN solder results in the grain refinement of the β-Sn phase, besides the formation of Ni 3 Sn IMC with small size and uniform distribution. The microhardness was enhanced as a result of the addition of TiO 2 or ZrO 2 NPs. The experimental results showed that the SZCN-ZrO 2 composite solder had the greatest hardness and stress exponent values due to its effectiveness in suppressing the growth of β-Sn grains and the pile-up of dislocations. Both the electrical and thermal conductivities were improved by incorporating TiO 2 NPs compared to other solders.

materials science, multidisciplinary,engineering, electrical & electronic,physics, applied, condensed matter