Surface stress redistribution and thermal performance of tempered vacuum glazing with printing sintering support pillars
Xiaobo Xi,Biao Wang,Yangjie Shi,Yunhan Zou,Qi Zhang,Yifu Zhang,Baofeng Zhang,Guangliang Zhao,Jianfeng Zhang,Ruihong Zhang
DOI: https://doi.org/10.1016/j.vacuum.2024.113400
IF: 4
2024-06-19
Vacuum
Abstract:The support stress distribution of the printing sintering support pillars (PSSP), which became rounded due to the shrinkage that occurred in sintering formation, was different from that of the conventional cylindrical metal support pillars (CMSP). In this paper, ANSYS software was used to establish the mechanical simulation model of tempered vacuum glazing with PSSP. The influence of PSSP arrangement (spacing D , and three arrangement styles of square, regular triangle, and regular hexagon) on the mechanical properties of tempered vacuum glazing were analyzed, including the maximum stress σ 1max on tempered glass (T-glass) surface, the maximum deformation ω 1max of T-glass, and the maximum stress σ 2max on the PSSP. The simulation results showed that when the PSSP were arranged in a square with D of 50 mm, σ 1max , ω 1max , and σ 2max were 26.39 MPa, 7.82 μm, and 546.72 MPa, respectively, which met the requirements of the evaluation indexes of mechanical properties of tempered vacuum glazing, and had the least number of PSSP. The mechanical properties of tempered vacuum glazing with regular triangle arrangement of PSSP were better than those of square and regular hexagon arrangements, and the σ 1max , ω 1max and σ 2max of which were 16.24 MPa, 7.25 μm and 489.66 MPa respectively, but with a too large number of PSSP. Optimization of the triangle layout angle and side length could reduce PSSP numbers. When the PSSP were arranged in an isosceles triangle with a 65° base angle and 50 mm bottom length, the mechanical properties of tempered vacuum glazing were the best. The triangular arrangement of PSSP had an optimization effect on the surface stress redistribution of tempered vacuum glazing, and the number of stress peaks was twice that of the square arrangement. Meanwhile, tempered vacuum glazing samples were made and the surface stress, thermal conductivity tests were conducted. The results showed that the measured values of peak and valley stress had an error of ±2.8 MPa compared to the simulated values. The simulation results were reliable and the surface stress redistribution of tempered vacuum glazing was present. The measured heat transfer coefficient of tempered vacuum glazing with PSSP was 0.7402 W m −2 K −1 , slightly higher than that of tempered vacuum glazing with CMSP. The difference between them was not significant.
materials science, multidisciplinary,physics, applied