Abstract:Electronic and photonic technologies have transformed our lives—from computing and mobile devices, to information technology and the internet. Our future demands in these fields require innovation in each technology separately, but also depend on our ability to harness their complementary physics through integrated solutions1,2. This goal is hindered by the fact that most silicon nanotechnologies—which enable our processors, computer memory, communications chips and image sensors—rely on bulk silicon substrates, a cost-effective solution with an abundant supply chain, but with substantial limitations for the integration of photonic functions. Here we introduce photonics into bulk silicon complementary metal–oxide–semiconductor (CMOS) chips using a layer of polycrystalline silicon deposited on silicon oxide (glass) islands fabricated alongside transistors. We use this single deposited layer to realize optical waveguides and resonators, high-speed optical modulators and sensitive avalanche photodetectors. We integrated this photonic platform with a 65-nanometre-transistor bulk CMOS process technology inside a 300-millimetre-diameter-wafer microelectronics foundry. We then implemented integrated high-speed optical transceivers in this platform that operate at ten gigabits per second, composed of millions of transistors, and arrayed on a single optical bus for wavelength division multiplexing, to address the demand for high-bandwidth optical interconnects in data centres and high-performance computing3,4. By decoupling the formation of photonic devices from that of transistors, this integration approach can achieve many of the goals of multi-chip solutions5, but with the performance, complexity and scalability of ‘systems on a chip’1,6–8. As transistors smaller than ten nanometres across become commercially available9, and as new nanotechnologies emerge10,11, this approach could provide a way to integrate photonics with state-of-the-art nanoelectronics.

Unified laser stabilization and isolation on a silicon chip

Unified laser stabilization and isolation on a silicon chip

3D integration enables ultralow-noise isolator-free lasers in silicon photonics

Hybrid Integrated Narrow-Linewidth Semiconductor Lasers

Three-dimensional integration enables ultra-low-noise, isolator-free Si photonics

Passive On-Chip Nonlinear Optical Isolators with Built-in Laser Stabilization

Scalable Feedback Stabilization of Quantum Light Sources on a CMOS Chip

A Monolithically-Integrated Chip-to-Chip Optical Link in Bulk CMOS

Integrated resonant electro-optic comb enabled by platform-agnostic laser integration

High Power On-Chip Integrated Laser

Low Noise, Tunable Silicon Photonic Lasers

High-performance lasers for fully integrated silicon nitride photonics

Laser Soliton Microcombs Heterogeneously Integrated on Silicon

Integrating photonics with silicon nanoelectronics for the next generation of systems on a chip

Innovative Integration of Dual Quantum Cascade Lasers on Silicon Photonics Platform

Back-scatter immune injection-locked Brillouin laser in silicon

36 Hz integral linewidth laser based on a photonic integrated 4.0-meter coil resonator

Integrated Passive Nonlinear Optical Isolators

Monolithic piezoelectrically tunable hybrid integrated laser with sub-fiber laser coherence

Laser soliton microcombs on silicon

On-Chip Optical Isolation in Monolithically Integrated Non-Reciprocal Optical Resonators