Development and analysis of a simple structured and economic miniature vapor compression refrigerator for cooling electronics in harsh environment

Haojie Zhou,Ji Li

DOI: https://doi.org/10.1016/j.applthermaleng.2023.120047

IF: 6.4

2023-03-01

Applied Thermal Engineering

Abstract:Compared with the previous cooling technologies for electronics, the miniature refrigeration technology can effectively eliminate hot spots and ensure that the junction temperature is at a lower level to ensure that electronics operate with better performance, especially in harsh environments. However, the high cost and low performance of the refrigeration system hinder its practical application. In this paper, based on a simple porous media evaporator, a simple structured and economic miniature vapor compression refrigeration system is proposed and developed. The overall size of the system is 380 mm × 350 mm × 58 mm and the total weight is only 2.0 kg. It can achieve a heat dissipation of 100 W with a total energy efficiency ratio (EER) of 2.25 and ensure that the chip temperature is approximately the ambient temperature (e.g., 30 ℃). The effects of the compressor speed and heat load on the cooling performance of the system under steady-state conditions are studied. Meanwhile, the transient processes of the system at different heat loads are systematically examined. The results show that the system can maintain a chip temperature lower than/close to the ambient temperature, which is critical for autonomous vehicle electronics in harsh environments.

energy & fuels,engineering, mechanical,thermodynamics,mechanics