Abstract:This article presents a 39 GHz transceiver front-end chipset for 5G multi-input multi-output (MIMO) applications. Each chip includes two variable-gain frequency-conversion channels and can support two simultaneous independent beams, and the chips also integrate a local-oscillator chain and digital module for multi-chip extension and gain-state control. To improve the radio-frequency performance, several circuit-level improvement techniques are proposed for the key building blocks in the front-end system. Furthermore, an advanced low-temperature co-fired ceramic process is developed to package the 39 GHz dual-channel transceiver chipset, and it achieves low packaging loss and high isolation between the two transmitting (TX)/receiving (RX) channels. Both the chip-level and system-in-package (SIP)-level measurements are conducted to demonstrate the performance of the transceiver chipset. The measurement characteristics show that the TX SIP provides 11 dB maximum gain and 10 dBm saturated output power, while the RX SIP achieves 52 dB maximum gain, 5.4 dB noise figure, and 7.2 dBm output 1 dB compression point. Single-channel communication link testing of the transceiver exhibits an error vector magnitude (EVM) of 3.72% and a spectral efficiency of 3.25 bit·s−1·Hz−1 for 64-quadrature amplitude modulation (QAM) modulation and an EVM of 3.76% and spectral efficiency of 3.9 bit·s−1·Hz−1 for 256-QAM modulation over a 1 m distance. Based on the chipset, a 39 GHz multi-beam prototype is also developed to perform the MIMO operation for 5G millimetre wave applications. The over-the-air communication link for one- and two-stream transmission indicates that the multi-beam prototype can cover a 5–150 m distance with comparable throughput.

A Fully Integrated, Dual Channel, Flip Chip Packaged 113 GHz Transceiver in 28nm CMOS supporting an 80 Gb/s Wireless Link

Integrated D-Band Transmitter and Receiver for Wireless Data Communication in 65 Nm Cmos

D-band CMOS Transmitter and Receiver for Multi-Giga-bit/sec Wireless Data Link

Integrated Dual-DFB Laser for 408 GHz Carrier Generation Enabling 131 Gbit/s Wireless Transmission over 10.7 Meters.

Chip Based THz Emitter for Ultra-high Speed THz Wireless Communication

0.4 THz Photonic-Wireless Link with 106 Gb/s Single Channel Bitrate

A 56 – 65 GHz Highly-Integrated FMCW Radar Transceiver with 7.8 Db NF and 8 GHz Chirp-Bandwidth in 65-Nm CMOS

Single-lane 200 Gbit/s Photonic Wireless Transmission of Multicarrier 64-QAM Signals at 300 GHz over 30 M

A 39 GHz Dual-Channel Transceiver Chipset with an Advanced LTCC Package for 5G Multi-Beam MIMO Systems

A Silicon-Based Integrated Photonic-Assisted Emitter for High Date-Rate Microwave Wireless Communication

Silicon Photonic Micro-Ring Modulator-based 4 x 112 Gb/s O-band WDM Transmitter with Ring Photocurrent-based Thermal Control in 28nm CMOS

13.6 A 42gb/s 60ghz CMOS Transceiver for IEEE 802.11Ay.

A 26-Gb/s 140-Ghz OOK CMOS Transmitter and Receiver Chipset for High-Speed Wireless and Dielectric Waveguide Communication

A Low-Power SiGe BiCMOS 190-GHz Transceiver Chipset With Demonstrated Data Rates up to 50 Gbit/s Using On-Chip Antennas

A Fully Integrated CMOS 60-Ghz Transceiver for IEEE802.11ad Applications.

A 120 GHz Fully Integrated 10 Gb/s Short-Range Star-QAM Wireless Transmitter With On-Chip Bondwire Antenna in 45 nm Low Power CMOS

A 26-Gb/s 140-Ghz OOK CMOS Transmitter and Receiver Chipset for High-Speed Proximity Wireless Communication

An Energy-Efficient 10-Gb/s CMOS Millimeter-Wave Transceiver with Direct-Modulation Digital Transmitter and I/Q Phase-Coupled Frequency Synthesizer

CMOS Mm-Wave Transceivers for Gbps Wireless Communication

An 11.05 Mw/Gbps Quad-Channel 1.25-10.3125 Gbps Serial Transceiver With A 2-Tap Adaptive Dfe And A 3-Tap Transmit Ffe In 40 Nm Cmos

A Highly Integrated Energy-efficient CMOS Millimeter-wave Transceiver with Direct-modulation Digital Transmitter, Quadrature Phased-coupled Frequency Synthesizer and Substrate-Integrated Waveguide E-shaped Patch Antenna