Abstract:Two-dimensional (2D) transition metal dichalcogenides (TMDs), such as MoS2 and WS2 have been widely studied due to their unique physical and electronic properties even at one atomic layer thickness. Since the first report on the MoS2 field-effect transistor (FET) device [1], great efforts have been made in the past decade to extend the intriguing features of TMDs to practical applications. However, such integration has been severely bottlenecked by the lack of effective approaches to achieve wafer-scale, uniform, crystalline and stoichiometric TMD films. Till now, it is still prevalent to fabricate TMD-based electronic devices using mechanical exfoliation methods. Although single-crystal flakes with least defects can be obtained, the size, thickness and location of the exfoliated TMD flakes are largely uncontrollable, making it unsuitable for large-scale device integration and massive production. So far, various synthetic approaches have been proposed to grow large-area TMD thin films. Chemical vapor deposition (CVD)-based method is one of the major routines to synthesize high-quality monolayer and few-layer TMD flakes [2-4]. For example, in typical CVD processes to grow MoS2, the films can be achieved either by the reduction reaction between the S and MoO3 source powders or by sulfurizing the Mo (or MoOx) films pre-deposited by using physical vapor deposition. However, the nucleation sites in the CVD process are uncontrollable which may lead to the vertical stacking of the MoS2 flakes in triangle shape deteriorating the crystalline properties of the film. On the other hand, the pre-deposited Mo or MoOx film by using e-beam evaporation or sputtering usually suffer from rough surface morphology and unsatisfactory film uniformity which further limit the homogeneity of the large-scale film and device integration. Atomic layer deposition (ALD) is a surface-controlled film fabrication and can provide a possible route towards the synthesis of TMD thin films since the ALD approach follows the layer-by-layer deposition mechanism [5,6]. As compared to the conventional CVD method, ALD can enable precise thickness control on atomic scale and excellent film uniformity as well as good stoichiometry and crystallinity with proper annealing steps. In this work, we employed the ALD-based synthesis method to grow wafer-scale MoS2 and WS2 thin films. Non-toxic MoCl5, WCl5 and hexamethyldisilathiane (HMDST) precursors have been used which are different and superior to those used in previous work. Film characterizations have confirmed the wafer-level uniformity, crystallinity and stoichiometry of the synthesized films. Homogeneous electrical behaviors have also been obtained from the fabricated FET device arrays. In addition, optoelectronic devices such as photodetectors and simple logic gates such as n-type inverter arrays have been demonstrated using the wafer-scale MoS2 FET arrays. Furthermore, we have used the substitutional doping in the ALD process to achieve controllable p-type doping of MoS2 films, which can provide solid basis for the complimentary metal-oxide-semiconductor (CMOS) integrated circuit applications. This work shows that the ALD-based synthesis of the 2D TMD thin films is an attractive approach and has provided a promising platform to further push forward the circuit and system level applications of the TMD materials. References [1] B. Radisavljevic, et al., Nature Nanotechnol. 6, 147 (2011). [2] Y. H. Lee, et al., Adv. Mater. 24 2320 (2012). [3] X. S. Wang, et al., J. Am. Chem. Soc. 135, 5304 (2013). [4] Y. J. Zhan, et al., Small 8, 966 (2012). [5] S. M. George, Chem. Rev. 110, 111 (2010). [6] G. N. Parsons, et al., J. Vac. Sci. Technol. A 31, 11 (2013).

Wafer‐Scale Demonstration of Polycrystalline MoS2 Growth on 200 mm Glass and SiO2/Si Substrates by Plasma‐Enhanced Atomic Layer Deposition

Chemical Vapor Deposition Of Large-Size Monolayer Mose2 Crystals On Molten Glass

Wafer-scale MOCVD growth of monolayer MoS2 on sapphire and SiO2

Large Area Vapor Phase Growth and Characterization of MoS2 Atomic Layers on SiO2 Substrate

ALD-Based Synthesis of Wafer-Scale Transition Metal Dichalcogenides Towards Nanoelectronics and Optoelectronics Applications

12-inch growth of uniform MoS2 monolayer for integrated circuit manufacture

Chemical Vapor Deposition of Uniform and Large-Domain Molybdenum Disulfide Crystals on Glass/Al2O3 Substrates

Atomic layer deposited 2D MoS2 atomic crystals: from material to circuit

Epitaxial growth of wafer-scale molybdenum disulfide semiconductor single crystals on sapphire

Scalable growth of atomically thin MoS2 layers in a conventional MOCVD system using molybdenum dichloride dioxide as the molybdenum source

Growth of wafer-scale MoS2 monolayer by magnetron sputtering.

Scalable growth of atomically thin MoS 2 layers in a conventional MOCVD system using molybdenum dichloride dioxide as the molybdenum source

Highly Reproducible Epitaxial Growth of Wafer‐Scale Single‐Crystal Monolayer MoS2 on Sapphire

Atomic Layer Deposition of Transition-Metal Dichalcogenides

High Performance Few-Layer MoS2 Transistor Arrays with Wafer Level Homogeneity Integrated by Atomic Layer Deposition

Cotrollable growth of monolayer MoS2 films and the application in devices

Epitaxy of Wafer-Scale Single-Crystal MoS2 Monolayer Via Buffer Layer Control

Top-Down Integration of Molybdenum Disulfide Transistors with Wafer-Scale Uniformity and Layer Controllability.

Direct liquid injection pulsed-pressure CVD of large area MoS2 on Si/SiO2

Uniform Growth of Sub-5-Nanometer High-κ Dielectrics on MoS2 Using Plasma-Enhanced Atomic Layer Deposition

Layer-by-layer epitaxy of multilayer MoS2 wafers