A 100-Ghz Power Amplifier with 21%/40.5% 1-/3-db FBW and 15.1-Dbm $p_{\mathrm{sat}}$ Using Pole-Tuning Interstage Matching Network in 65-Nm CMOS

Yiting Zhang,Nengxu Zhu,Zhen Yang,Fanyi Meng
DOI: https://doi.org/10.1109/lmwt.2024.3473932
2024-01-01
Abstract:This letter presents a wideband two-way current-combining power amplifier (PA) for sub-terahertz (sub-THz) wireless communication. The transformer-based fourth-order pole-tuning interstage matching network (IMN) is proposed, analyzed, and adopted to feature flat in-band frequency responses. Fabricated in 65-nm CMOS technology, the PA chip achieves a 1-/3-dB bandwidth of 21.0/40.2 GHz (90.0-111.0/81.1-121.3 GHz) with 21.0%/40.5% 1-/3-dB fractional bandwidth, 15.1-dBm saturated output power, and a peak power-added efficiency (PAE) of 17.1% at 114 GHz. The core chip area of the proposed PA is only 0.12 mm( 2) , leading to a power density of 269.7 mW/mm( 2) .
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