Abstract:1.1 Categorisation of cooling techniques The need for higher heat flux cooling techniques is driven very much by the microelectronics and semiconductor industry. In accordance with Moore’s Law, continuing advances in the semiconductor industry allow the device feature size to shrink and the transistor density and switching speed to double every one and a half to two years. Correspondingly, the heat dissipation from the chip increases in proportion, if there is no change in the semiconductor technology. In their study on the limits of device scaling and switching speeds, Zhirnov et al. (2003) concluded that “even if entirely different electron transport models are invented for digital logic, their scaling for density and performance may not go much beyond the ultimate limits obtainable with CMOS technology, due primarily to limits on heat removal capacity”. For example, maximum heat flux at the localized submillimeter scale hotspots of high performance chips approaches 1 kW/cm2 (Bar-Cohen et al., 2006). The operating efficiencies and stability of these devices depend on how effectively the heat generated can be removed from the system. Hence, developments in the cooling system have to keep apace with the heat removal requirements, starting with forced air convection being enhanced by compact finned heat sinks, to liquid-cooled microchannel arrays, and ultimately using phase change heat transfer through the boiling phenomena or from atomized sprays and jets. The choice of an appropriate cooling technique is however dependent on the specific application and the critical system factors which must be satisfied, such as the maximum permissible heat flux, total heat load, tight temperature tolerances, reliability considerations or overall power consumption. The operating environment also play a significant part which may necessitate an emphasis on the use of space, complexity of the system’s components, relative maturity of the technology or cost. Table 1 shows comparative cooling technologies and the respective heat fluxes and heat transfer coefficients (Glassman, 2005). There may be other work that list values outside of this table, but the nominal capacities of these cooling technologies in the table can still be viewed as a good reference. In general, cooling methods using sub-cooled flow boiling (SCFB), micro-channel cooling, two-phase jet impingement and spray cooling have achieved very high heat fluxes (over 100 W/cm2) and heat transfer coefficients compared

Heat Transfer Characteristics of Dielectric Fluid Spray Cooling Targeting High Heat Flux and High Evaporation Efficiency

Experimental Investigation of Spray Cooling Performance in Non‐boiling Zone on Rough Superhydrophilic/hydrophobic Surfaces

Influence of Parameters in Two-Phase Spray Heat Dissipation of Electronic Components

Experimental Study on a Spray and Falling-Film Cooling System

Heat Transfer Characteristics of Spray Cooling Beyond Critical Heat Flux under Severe Heat Dissipation Condition

Experimental and Numerical Studies on the Spray Cooling of Deionized Water in Non-Boiling Regime

Experimental Study on Phase Change Spray Cooling

Heat Transfer Enhancement Due to Surface Modification in the Close-Loop R410A Flash Evaporation Spray Cooling

Heat Transfer Performance and Optimization of a Close-Loop R410A Flash Evaporation Spray Cooling

Parametric Investigation on the Close-Loop R410A Flash Spray System for High Power Electronics Cooling under Low Temperature

Spray Cooling and Flash Evaporation Cooling: the Current Development and Application

Coupling dynamic thermal analysis and surface modification to enhance heat dissipation of R410A spray cooling for high-power electronics

Electrospray Cooling Characteristics in Cone-Jet and Multi-Jet Modes

Optimizing Spray Cooling Systems: A Comprehensive Study on Influential Parameters and Their Effects on Heat Transfer under Varied Heat Flux Conditions

Characterization of dynamics and heat transfer in electro-spray at elevated flow rates

Experimental Investigation on Heat Transfer Characteristics of R1336mzz Flash Spray Cooling

Experiment Study of the Influence of Spray Height and Pressure on the Spray Cooling Performance

Spray characteristics and spray cooling heat transfer in the non-boiling regime

Application status and prospect of spray cooling in electronics and energy conversion industries

13 Spray Cooling

Experimental study of non-boiling heat transfer by high flow rate nanofluids spray