Advancements in Ni-P Plating Surfaces for Mitigating Crystallization Fouling in Microchannel Heat Exchangers

Jia Sun,Wei Li,Biqi Cao,Jianxin Zhou,Zan Wu

DOI: https://doi.org/10.1115/ht2024-130576

2024-01-01

Abstract:In pursuit of sustainable energy solutions and to combat the environmental challenges posed by fouling in thermal devices, this study developed Ni-P-TiO2 and Ni-P-Polytetrafluoroethylene (Ni-P-PTFE) surfaces and explored the effectiveness of coatings in minimizing fouling on heat exchange surfaces. We conducted heat exchange experiments to compare the both coating surfaces with copper surface under identical clean conditions in microchannels. Further analyses explored fouling resistance across surfaces at various flow rates and solution hardness, complemented by Scanning Electron Microscope (SEM) images of fouling morphology. The findings revealed that decreasing surface energy and enhancing hydrophobic properties can reduce crystal fouling. Notably, both Ni-P-TiO2 and Ni-P-PTFE surfaces demonstrated superior performance, showing significantly lower thermal resistance compared to copper surface. Despite the increase in thermal resistance with solution concentration, the growth rate of fouling resistance declined gradually. The Ni-P-PTFE coating, benefiting from its lower surface energy and greater hydrophobicity, showed superior looseness and porosity. This study demonstrates the effectiveness of Ni-P-TiO2 and Ni-P-PTFE coatings in reducing fouling thermal resistance, offering a promising approach for improving microchannel device performance.