Deep Neural Network Enhanced Chip-on-board Hybrid-Packaged Photonic-Electrical Silicon Transceiver for High-speed Optical Interconnects

Jun Qin,Qipeng Yang,Changhao Han,Yan Zhou,Yunhao Zhang,Yichen WU,Yu Sun,Junde Lu,Siming Liu,Yueqin Li,Jian Sun,Miao Min,Weiwei Hu,Zhixue He,Lei Wang,Shaohua Yu,Haowen Shu,Xingjun Wang
DOI: https://doi.org/10.1364/cleo_si.2024.sth1k.3
2024-01-01
Abstract:We explore implementing a multilevel deep neural network to enhance the performance of a 4-channel photonic-electrical hybrid-packaged silicon transceiver. Stable transmission and reception of 150 Gbps/λ PAM4 signals are achieved, which shows the potential for beyond-400G optical interconnects.
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