Abstract:With the rapid development of modern electronic technology, addressing the heat dissipation problem of devices has become more and more urgent. Herein, the effects of molybdenum disulfide (MoS2) and hybrid hexagonal boron nitride (h-BN)/MoS2 fillers on the thermal conductivity of polydimethylsiloxane (PDMS) were investigated by reverse non-equilibrium molecular dynamics (RNEMD) simulation with fully atomistic model. Firstly, we simulated the thermal conductivity of MoS2 and BN fillers. It was found that the thermal conductivity of the two fillers enhanced with the increase of their sizes. The intrinsic thermal conductivity of MoS2 and BN obtained via the extrapolation were 52 W/(m·K) and 606 W/(m·K) separately. For 1-5 layers, the number of layers has almost no effect on the thermal conductivity of MoS2, but as the number of layers increase, the thermal conductivity of BN first decreases and then reaches a plateau. Then, we studied the thermal conductivity of the PDMS-based composites. Due to the existence of holes in the PDMS/MoS2 system, the thermal conductivity of PDMS/MoS2 composites is not much improved compared with that of PDMS. Therefore, we then introduced a hybrid BN/MoS2 filler into the composite to solve the void problem in the system. The results proved that this method was effective. The introduction of the hybrid BN/MoS2 filler effectively promoted the dispersion of the two fillers in the PDMS matrix and greatly reduced the holes in the composites. Compared with the composites filled with only one kind of filler, PDMS/BN/MoS2 composites possess better thermal conductivity. The most surprising finding is that there exists an optimal loading ratio of the two fillers, and the thermal conductivity of the composite reached the maximum when the mass ratio of the two fillers is approximately 1:1, attributed to the change of the volume fraction of holes(<math>Φ</math>). In addition, with the increase of hybrid BN/MoS2 filler content, the thermal conductivity of the composites is also increasing. The oscillating shear can also promote the orientation of the filler along the shear direction and improve the thermal conductivity of composites along that direction. Therefore, composites based on hybrid BN/MoS2 nano-fillers can be used to improve the thermal conductivity of insulating polymer materials. The findings should shed some light on the design and preparation of polymer composites with excellent thermal conductivity and electrical insulation properties.

Towards High-Performance Polydimethylsiloxane-Based Materials for Thermal Management: A Molecular Dynamics Study

Exploring Trade-offs in Thermal Interface Materials: the Impact of Polymer-Filler Interfaces on Thermal Conductivity and Thixotropy

Improving through-plane thermal conductivity of PDMS-based composites using highly oriented carbon fibers bridged by Al2O3 particles

Exploring Thermal Interface Materials for Electronics Via Molecular Dynamics Simulations: A Review

Molecular Dynamics Simulation on the Heat Transfer in the Cross-Linked Poly(dimethylsiloxane).

Strategies for enhancing thermal conductivity of polymer-based thermal interface materials: a review

Joint‐Inspired Liquid and Thermal Conductive Interface for Designing Thermal Interface Materials with High Solid Filling yet Excellent Thixotropy

Effect of Surface Functionalization of Si3N4 Fillers on Thermal and Mechanical Properties of TIMs

Designing high thermal conductivity of polydimethylsiloxane filled with hybrid h-BN/MoS2 via molecular dynamics simulation

Enhanced thermal conductivity for polydimethylsiloxane composites with core-shell CFs@SiC filler

Interacted boron nitride/Mxene hybrids with vertically aligned networks for improving the thermal conductivity, electromagnetic wave absorption and mechanical properties for the polymer-based thermal interface materials

Synergistic Enhanced Thermal Conductivity of Polydimethylsiloxane Composites Via Introducing SCF and Hetero-Structured GB@rGO Hybrid Fillers

Thermal Interface Materials with High Thermal Conductivity and Low Young's Modulus Using a Solid-Liquid Metal Codoping Strategy

Compliance-tunable thermal interface materials based on vertically oriented carbon fiber arrays for high-performance thermal management

Polyhedral Oligosilsesquioxane-Modified Alumina/Aluminum Nitride/Silicone Rubber Composites to Enhance Dielectric Properties and Thermal Conductivity

Enhanced interfacial heat-transfer of Al2O3-MXene-silicone composite via an electrostatic self-assembly strategy

Synergistic effect of carbon fiber and alumina in improving the thermal conductivity of polydimethylsiloxane composite

Thermal Interface Materials with Sufficiently Vertically Aligned and Interconnected Nickel-Coated Carbon Fibers under High Filling Loads Made Via Preset-Magnetic-field Method

Enhancement of thermal conductivity and insulation of silicone thermal interface material through surface modification and synergistic effects of nanofillers for thermal management of electronic devices

Effect of spherical alumina crystalline phase content and particle size distribution polydispersity on the properties of silicone rubber composites

Effect of segment structure of monotrimethoxysilylethyl-terminated asymmetric Polysiloxanes on the thermal management performance of AlN-filled silicone pastes