Thermal Aging Characteristics of Epoxy Resin: Chemical Structure and Dielectric Property

Xiaoxiao Kong,Chong Zhang,Zhuoran Yang,Hangyu Mi,Chengyao Hou,Qi Li,Boxue Du

DOI: https://doi.org/10.1109/icd59037.2024.10613087

2024-01-01

Abstract:Epoxy resin, widely used as an insulating material in electrical power equipment, may face the risk of degradation in its insulating performance when exposed to high temperatures over extended periods. In this paper, epoxy resin samples were prepared and subjected to an accelerated thermal aging test at 180 °C for up to 1440 hours. The physicochemical and dielectric properties were tested at various thermal conditions. The experimental results indicate that the oxidation of hydrogen at the α-position of tertiary carbons in secondary alcohols and esters to form carbonyl groups is the primary reaction during the thermal aging process of epoxy resins, accompanied by the rearrangement of molecular structures due to reactive free radicals. In the early stages, molecular rearrangement and post-curing reactions are predominant, leading to a slight enhancement of dielectric properties. As aging progresses, the oxidation and scission of molecular chains intensify, alongside a decrease in crosslink density and a reduction in the level and density of deep traps. Furthermore, high-temperature aging is associated with the formation of low-density regions, increasing the number of internal defects, which significantly deteriorates the dielectric properties, with an 137% increase in conductivity and a corresponding 18.14% decrease in breakdown strength. This study provides valuable value insights for the assessment of the aging condition of epoxy resins.