Electromigration-induced failure behavior of low-temperature Cu/Sn-57Bi-1Ag/Cu solder joints

Li Li,Shengbo Wang,Junlin Chen,Mingliang Huang

DOI: https://doi.org/10.1109/ICEPT59018.2023.10491977

2023-01-01

Abstract:The electromigration-induced failure behavior of low-temperature Cu/Sn-57Bi-1Ag/Cu solder joints was investigated. At the early stage of electromigration (EM), Bi atoms migrated from the cathode and segregated at the anode, thus the anodic Bi-rich layer continuously grew thicker, resulting in an increasing resistance rise rate of solder joints. After EM for 436 h, voids were found in the internal of the solder, and a turning point of the resistance rise rate occurred. Finally, as the current density and Joule heat increased in the local zone, the solder melted accordingly, resulting in the transformation from the solid-solid (S-S) electromigration into the liquid-solid (L-S) electromigration. Finally, with the loss of molten solder, an open failure occurred eventually.