Performance Of Curing Epoxy Resins Containing Non-Coplanar Rigid Moieties
Jing Qin,Guo-Ping Zhang,Rong Sun,Guang-Ming Zhu,Ching-Ping Wong
DOI: https://doi.org/10.11777/j.issn1000-3304.2015.14284
2015-01-01
Acta Polymerica Sinica
Abstract:A kind of aromatic diamine,4',4 ''-(2,2-diphenylethene-1,1-diyl) dibiphenyl-4-amine (TPEDA) containing nonplanar rigid twisted moieties in the molecular structure was used as curing agent to prepare epoxy resins cured composites with commercial epoxy resins (E51). Comparing with conventional diamines (4,4'-diaminodiphenylmethane, DDM and 4,4 '-diaminodiphenylsulfone, DDS), the properties of system E51/TPEDA, such as glass transition temperature, elastic modulus, stress relaxation and creep, thermal expansion, the dielectric constant and dielectric loss, were roundly studied by dynamic mechanic analysis (DMA), thermal mechanic analysis (TMA), impedance analyzer,et al. The results show that the structure of rigid non-specific coplanar diamine TPEDA as epoxy curing agent,can significantly improve the glass transition temperature (258 degrees C), elastic modulus (23.7 MPa) and dimensional stability,while reduce the thermal expansion coefficient of the cured product (CTEI :61.9612 x 10(-6), CTE2 :138.3265 x 10(-6)) dielectric constant (4.76 at 1 kHz) and the dielectric loss (1.93 x 10(-2) at 1 MHz). When TPEDA which contains a special twisted steric structure is introduced into the epoxy resin main chain, it minimizes the strong interaction and tight stacking of the molecular chains and then increases the free volume of the polymers. Furthermore, the abundant rigid moieties in TPEDA used as curing agent can also improve the thermal stability of epoxy resins. Therefore E51/TPEDA can be used for high-density integrated circuit device package.