High-performance Radiative Cooling Film with Excellent Thermostability and Mechanical Property Realized by Self-Assembled Nanoparticles

Dongdong Liang,Jie Ren,Huan Liu,Yingxin Yang,Atsha Ambar,Ying Sun,Cong Wang

DOI: https://doi.org/10.1016/j.mtphys.2024.101425

IF: 11.021

2024-01-01

Materials Today Physics

Abstract:Radiative cooling as a new zero-energy cooling technology is promising for cooling highly integrated, miniaturized and flexible electronic devices. However, it's a challenge to combine outstanding cooling performance with excellent thermostability and mechanical properties for flexible radiative cooling films. Herein, a novel strategy to fabricate a high-performance SiO2-doped colorless polyimide (CPI)/Ag flexible film for efficient radiative cooling via controllable self-assembled SiO2 nanoparticles is demonstrated. The film has high solar reflectivity (96.58%, 0.4 - 2.5 mu m) and mid-infrared emissivity (91.24% ,5 - 20 mu m). A maximum cooling temperature of 7 degrees C below ambient and 10 degrees C lower than the bare aluminum device is achieved under direct sunlight. More importantly, the thermostability (T-g similar to 331 degrees C) and tensile strength (78 MPa) broaden its applicability. The strong interfacial interaction between the uniformly distributed tiny self-assembled nanoparticles and matrix plays crucial roles in enhancing radiative cooling performance, thermostability and mechanical properties. This work provides an effective strategy to realize efficient radiative cooling for electronic devices.