Abstract:Manufacturing a single long-length rare-earth barium copper oxide (REBCO) coated conductor (CC) tape with uniform critical current (Ic) is still a challenge; therefore, joining between multiple-length CC tapes is needed in the production of longer CC tapes for superconducting cables, coils, and magnets. Various joining techniques have been developed to achieve acceptably low joint resistance (Rj) with no Ic degradation and good electromechanical properties. The authors established ultrasonic welding (UW) and hybrid welding (HW) methods for joining Cu-stabilized CC tapes with different configurations. However, these methods have yet to be applied to Ag-stabilized CC tapes to produce compact joints and longer tapes during in-line production. This study used the UW and HW methods to fabricate Ag-stabilized CC joints to have low Rj without Ic degradation through a direct connection at the overlapped Ag layers between both CC tapes. Two CC tape samples with different thicknesses of ~2 μm and ~6 μm Ag stabilizers were supplied to produce UW and HW Ag-stabilized CC joints. These were compared with soldered CC joints fabricated by a mechanically controlled soldering method. In the case of UW, the design of experiment (DOE) using the Taguchi method was used to systematically determine the optimized weld parameter combination that yields a lower Rj without any Ic degradation. This study is a systematic attempt to evaluate the applicability of UW for solid-state joining between thin Ag layers, unlike the conventional joining of thick Cu stabilizers. Moreover, the electromechanical properties of differently processed Ag-stabilized REBCO CC joints were evaluated using both lap-shear and double-bending tests. As a result, the optimum UW parameter combinations were obtained to achieve Ag-stabilized CC joints. However, some variations were probably due to the differences in the production batch and thickness of the Ag layers. The UW Ag-stabilized CC joints showed superior joint characteristics and electromechanical properties compared to soldered CC joints. Good solid-state bonding of the Ag layers was observed through microscopic observation of the cross-section at the joint region of the UW CC joint. The joint characteristics and electromechanical properties of the UW Ag-stabilized CC joints can be further improved using the HW method.

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