Research Progress of Cu-Ni-Si Alloy for Lead Frame

Zhili Wan
2011-01-01
Abstract:The lead frames are one of the most important parts of IC encapsulation and semi-conductor electronic component,which provide mechanical support,send electric signal,and dissipate heat.The CuNiSi alloy has not only high strength and conductivity,but also it is low cost,so it is greatly developed as lead frame materials in recent years.This paper introduces the development survey of copper alloy for lead frame materials,the research status of CuNiSi alloy for lead frame materials is described,and the development prospect is analyzed.
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