Abstract:With the increased deployment of power modules in demanding conditions, sintering materials, especially composite sintering materials, have raised growing interest due to their cost-effectiveness and suitability. Therefore, this study explores the viability of Cu–Ag composite sintering material, focusing on solvent influence through microstructure and mechanical behavior analysis. Micron-sized particle-based Cu–Ag composite pastes were designed and compared using eight solvents (four epoxy-free and four epoxy-added) based on fluidity and thermal stability. The sintered joints' performance, assessed through shear strength analysis, showed comparable values to pure silver sintering for both epoxy-free and epoxy-added samples. Optimized samples from each solvent system underwent reliability analysis, demonstrating that Cu–Ag joints with epoxy resin exhibited significantly higher shear strength after high-temperature storage and thermal cycling tests. Micromorphology and elemental composition analysis revealed differences in aging mechanisms, primarily attributed to variations in porosity due to oxide formation and pore filling by epoxy resin under different solvent systems. Further nanoindentation characterization of micromechanical properties, including hardness, modulus, and creep properties, during high-temperature aging, established constitutive models for insights into reliability evolution. In conclusion, the optimized epoxy-added Cu–Ag sintered joints proposed in this study demonstrated exceptional reliability and acceptable micromechanical properties, presenting a promising option for high-temperature power packaging.

Novel Agcu Foam Sheet with Multi-Layer Composite Structure for High Performance Joining of SiC Power Chips

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Development of micron-sized Cu–Ag composite paste for oxidation-free bare Cu bonding in air condition and its deterioration mechanism during aging and power cycling tests

Microstructure evolution and micromechanical behavior of solvent-modified Cu–Ag composite sintered joints for power electronics packaging at high temperatures

Mechanical Properties and Microstructure of Low Temperature Sintered Joints Using Organic-Free Silver Nanostructured Film for Die Attachment of SiC Power Electronics

Long-lasting action mechanism of 3D skeleton regulated the residual stress fluctuations in SiC f /SiC heterogeneous joints

Highly Conductive Cu-Cu Joint Formation by Low-Temperature Sintering of Formic Acid-Treated Cu Nanoparticles

Shape Synergy of Ag@Cu Chip Packaging Nano‐Paste and Its Sintering Reliability

Improved thermal shock reliability of Ag paste sintered joint by adjusted coefficient of thermal expansion with Ag-Si atomized particles addition

Sintering Mechanism of a Supersaturated Ag-Cu Nanoalloy Film for Power Electronic Packaging

Effect of Cu foam on the microstructure and strength of the SiCf/SiC-GH536 brazed joint

A Supersaturated Cu-Ag Nanoalloy Joint with Ultrahigh Shear Strength and Ultrafine Nanoprecipitates for Power Electronic Packaging

Improved Thermal Conductivity and Reliability Through Graphene Reinforced Nanopaste for Power Devices in New Energy Vehicles

High-temperature Resistant Interconnections Formed by Ni Nanoparticles/Al Micro-particles Composite Paste for SiC Power Device Application

Enhanced shear strength and microstructure of Cu–Cu interconnection by low-temperature sintering of Cu nanoparticles

Interface-Mechanical and Thermal Characteristics of Ag Sinter Joining on Bare DBA Substrate During Aging, Thermal Shock and 1200 W/cm 2 Power Cycling Tests

Low-temperature packaging through Ag-Cu supersaturated solid solution nanoparticle paste for high-temperature power electronics

Ultra-low Temperature Sintering of Cu@Ag Core-Shell Nanoparticle Paste by Ultrasonic in Air for High-Temperature Power Device Packaging.