Abstract:In electronic packaging industry, it has been reported that compared with nano silver and nano copper, the complementation and coordination of Ag and Cu components enable bimetallic nanomaterials enhanced anti-electromigration and oxidation inhibition characteristics. Ag-Cu solid solution nanoparticles (ACDS NPs) has become an emerging substitution and garnered widespread attention. This research presents the investigation into the size-dependent melting behaviour of ACDS NPs and the effect of elevated temperature during the pressure-free sintering with Ag substrate through molecular dynamics simulations. The melting points of ACDS NPs turn out to be in accordance with Gibbs Thomson equation, based on which the suitable sintering temperatures have been determined within 473 and 773 K. As demonstrated by dynamic trajectories at cross section while sintering, coalescence between NPs occurs with the atomic surface diffusion at the sintering neck along the vacancy concentration gradient. 623 K is estimated to be a threshold temperature of complete integration of NPs at which the crystallographic structure collapses during sintering and recrystallizes at the late sintering stage. The dominant sintering mechanisms transferred from surface diffusion and dislocation-based plastic deformation below 573 K to atomic diffusion above 623 K. Furthermore, the results present incontrovertible dominance of Shockley dislocations and interaction energy on determining mechanical properties of sintered atomistic system. It is also revealed that the systems sintered below 673 K yield significantly lower thermal conductivity attributing to the strong localization of heat carriers for intrinsic amorphous structure than crystalline counterparts above 723 K.

Solidification of Undercooled Ag–Cu Eutectic Alloy with the Sb Addition

Solidification behavior and microstructure of Ag–Cu eutectic alloy at different sub-rapid cooling rates

Solidification Microstructure in a Supercooled Binary Alloy

Non-equilibrium solidification of bulk undercooled Ni–P eutectic alloys

Effect of Minor Addition of Co on Nonequilibrium Solidification of Deeply Undercooled Cu Based Alloys

Growth Velocity-Undercooling Relationship and Structure Refinement Mechanism of Undercooled Ni-Cu Alloys

Microstructure Refinement Mechanism of Undercooled Cu55Ni45 Alloys

Rapid Solidification Structure Refinement Mechanism in Highly Undercooled Cu Based Ternary Alloys

Effect of Co Addition on Solidification Velocity, Hardness and Refined Structure Transformation Mechanisms of Undercooled Ni-Cu-Co Alloys

Growth Mechanism of Eutectic Si in Super-Gravity Solidified Al-Si Alloy During Annealing

Rapid Solidification of Non-Stoichiometric Intermetallic Compounds: Modeling and Experimental Verification

Influence of Super Gravity Field on Solidification Structures of Cu98.4 Cr1.6 Alloy

Stepped Interface and Crystal Orientation in the Eutectic Structure of Cu-71.8%Ag Alloy

Influence of Super-Gravity Coefficient on Spatial Distribution of Solidification Structure in Al-14.5Si Alloys

Solidification Microstructure Evolution and Grain Refinement Mechanism under High Undercooling of Undercooled Ni90Cu10 Alloys

Dendritic Solidification of Highly Undercooled Dilute Alloys

Ag–Sb/Cu interfacial reactions and Ag–Cu–Sb phase equilibria

Columnar to equiaxed transition during growth of a univariant eutectic

Towards enhanced elevated-temperature mechanical properties by regulation of eutectic structure in Al-Cu-Si alloys solidified under super-gravity field

Atomic Insights into the Sintering Behaviour of Ag-Cu Solid Solution Nanoparticles on Ag Substrate

Study of the precipitate evolution mechanism in an Al-Mg-Si-Cu alloy with Si-rich and low Cu composition