WITHDRAWN: Strain Rate and Temperature Effects on the Mechanical Properties of Cured Isotropic Conductive Adhesive (ICA) at Micro Scale

Gesheng Xiao,Zhigang Li,Erqiang Liu,Li Qiao,Xinqi Yang,Xuefeng Shu,Ruijing Sun
DOI: https://doi.org/10.1016/j.mechmat.2018.03.004
IF: 4.137
2018-01-01
Mechanics of Materials
Abstract:This article has been withdrawn at the request of the author(s) and/or editor. The Publisher apologizes for any inconvenience this may cause. The full Elsevier Policy on Article Withdrawal can be found at http://www.elsevier.com/locate/withdrawalpolicy.
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