Abstract:We review recent advances in experimental methods for high spatial-resolution and high time-resolution thermometry, and the application of these and related methods for measurements of thermal transport in low-dimensional structures. Scanning thermal microscopy (SThM) achieves lateral resolutions of 50 nm and a measurement bandwidth of 100 kHz; SThM has been used to characterize differences in energy dissipation in single-wall and multi-wall carbon nanotubes. Picosecond thermoreflectance enables ultrahigh time-resolution in thermal diffusion experiments and characterization of heat flow across interfaces between materials; the thermal conductance G of interfaces between dissimilar materials spans a relatively small range, 20 <G <200 MW m(-2) K-1 near room temperature. Scanning thermoreflectance microscopy provides nanosecond time resolution and submicron lateral resolution needed for studies of heat transfer in microelectronic, opto-electronic and micromechanical systems. A fully-micromachined solid immersion lens has been demonstrated and achieves thermal-radiation imaging with lateral resolution at far below the diffraction limit, <2 mum. Microfabricated metal bridges using electrical resistance thermometry and joule heating give precise data for thermal conductivity of single crystal films, multilayer thin films, epitaxial superlattices, polycrystalline films, and interlayer dielectrics. The room temperature thermal conductivity of single crystal films of Si is strongly reduced for layer thickness below 100 nm. The through-thickness thermal conductivity of Si-Ge and GaAs-AlAs superlattices has recently been shown to be smaller than the conductivity of the corresponding alloy. The 3omega method has been recently extended to measurements of anisotropic conduction in polyimide and superlattices. Data for carbon nanotubes measured using micromachined and suspended heaters and thermometers indicate a conductivity near room temperature greater than diamond.

Thermally Driven Interfacial Dynamics of Metal/Oxide

Thermally Driven Interfacial Dynamics of Metal/oxide Bilayer Nanoribbons.

Atomic Investigation on the Facet‐Dependent Melting of Ceramic Nanostructures Via in Situ Electron Irradiation

Pure Electronic Metal-Insulator Transition at the Interface of Complex Oxides

Effects of Chemical Bonding on Heat Transport Across Interfaces

Thermal Visualization of Buried Interfaces by Transient and Steady-State Responses of Time-Domain Thermoreflectance

Thermal Visualization of Buried Interfaces Enabled by Ratio Signal and Steady-State Heating of Time-Domain Thermoreflectance

Giant Thermal Transport Tuning at a Metal/Ferroelectric Interface

Thermometry and Thermal Transport in Micro/Nanoscale Solid-State Devices and Structures

Thermally Induced Structural Evolution and Nanoscale Interfacial Dynamics in Layered Metal Chalcogenides

Dynamic Interfacial Mechanical-Thermal Characteristics Of Atomically Thin Two-Dimensional Crystals

Dynamic investigation of interface atom migration during heterostructure nanojoining.

Direct observation of nanoscale Peltier and Joule effects at metal-insulator domain walls in vanadium dioxide nanobeams.

Interdiffusion Mechanism and Thermal Conductance at the Interfaces in Cu-to-Cu Bonds Achieved by Coating Nanolayers

Thermal Driven Giant Spin Dynamics at Three-Dimensional Heteroepitaxial Interface in Ni0.5Zn0.5Fe2O4/BaTiO3-Pillar Nanocomposites

Thermal interfacial coupling between electroplated copper and indium

Insight into Metalized Interfaces in Nano Devices by Surface Analytical Techniques.

Atom-by-atom imaging of moiré transformations in 2D transition metal dichalcogenides

Quantifying Interfacial Bonding Using Thermal Boundary Conductance at Cubic Boron Nitride/Copper Interfaces with a Large Mismatch of Phonon Density of States.

Van Der Waals Interaction-Tuned Heat Transfer in Nanostructures.

Nanoengineering Heat Transfer Performance At Carbon Nanotube Interfaces