New Development of IC Design Methodology

Jian Xie

2008-01-01

Abstract:In this paper, the actuality of IC design technology is reviewed.Then various design methods ,such as IP-based design , platform-based design,new methods for mixed-signal IC, DSP are discussed. The recon- structive IP -based design method and new technologies for exceed deep sub-micro IC are analyzed.

What problem does this paper attempt to address?

Recent Advances in Monolithic Integration of Diverse Technologies with Si CMOS

Tahir Hussain,Dana C. Wheeler,Hasan Sharifi,Keisuke Shinohara,Zhiwei Xu,James C. Li,Pamela R. Patterson,Kenneth R. Elliott,Wonill Ha,Yakov Royter,Peter D. Brewer

DOI: https://doi.org/10.1109/sirf.2014.6828535

2014-01-01

Abstract:HRL Laboratories is part of an intense research and development effort to leverage the enormously advanced infrastructure of Si CMOS and the high performance of diverse electronic and photonic devices in an integrated technology. While System in a Package (SiP) and System on a Chip (SoC) approaches involve chips produced in their native foundries and subsequent integration using hybridization or multi-chip modules, HRL has pioneered approaches where partially completed wafers of diverse technologies are integrated using highly intimate placement and heterogeneous interconnects to enable transistor-level integration. Novel ICs have been produced in InP BiCMOS and CMOS memristor-integrated technologies. Unprecedented design flexibility is being enabled with intimate integration of GaN HEMTs together with InP and CMOS.
Technology Platform for IC Design in Nano-scale CMOS

Cheng, Y.

DOI: https://doi.org/10.1109/icsict.2006.306461

2006-01-01

Abstract:This paper discusses the technology platform development for IC design in nano-CMOS technologies. New effects and issues in nano-CMOS are reviewed before the discussion on the contents of the technology platform. Some key components are briefly discussed with the exploration of some further challenges to develop a RF SOC design technology platform. An advanced technology platform with strong links to process and device behavior and efficient simulation approaches is critical to a successful advanced IC design in nano-scale CMOS technologies
Digital Electronic System-on-Chip Design: Methodologies, Tools, Evolution, and Trends

Marcian Cirstea,Khaled Benkrid,Andrei Dinu,Romeo Ghiriti,Dorin Petreus

DOI: https://doi.org/10.3390/mi15020247

IF: 3.4

2024-02-08

Micromachines

Abstract:This paper reviews the evolution of methodologies and tools for modeling, simulation, and design of digital electronic system-on-chip (SoC) implementations, with a focus on industrial electronics applications. Key technological, economic, and geopolitical trends are presented at the outset, before reviewing SoC design methodologies and tools. The fundamentals of SoC design flows are laid out. The paper then exposes the crucial role of the intellectual property (IP) industry in the relentless improvements in performance, power, area, and cost (PPAC) attributes of SoCs. High abstraction levels in design capture and increasingly automated design tools (e.g., for verification and validation, synthesis, place, and route) continue to push the boundaries. Aerospace and automotive domains are included as brief case studies. This paper also presents current and future trends in SoC design and implementation including the rising, evolution, and usage of machine learning (ML) and artificial intelligence (AI) algorithms, techniques, and tools, which promise even greater PPAC optimizations.

chemistry, analytical,nanoscience & nanotechnology,instruments & instrumentation,physics, applied
Reconfigurable Designs for Networking Silicon.

Tao Li,Zhentao Liu,Huimin Du,Lei Zhang,Jungang Han,Lin Jiang,Qingang Dong

DOI: https://doi.org/10.1109/ipdpsw.2012.35

2012-01-01

Abstract:This paper presents a reconfigurable architecture and associated design methodology for developing networking silicon chips. The tools include most of the common traffic QoS features and low level interfaces as well as some special features for extensible design. When coupled with the design tools, this architecture provides powerful capabilities for the design of highly flexible networking silicon IP cores.
Non-probabilistic reliability-based structural design optimization based on the interval analysis method

WuChao QI,ZhiPing QIU

DOI: https://doi.org/10.1360/132012-113

2013-01-01

Abstract:The technology development of micro-nano electronics in global IC industry is summarized and reviewed in the present paper. There are many challenges and opportunities as the innovative devices and materials have gradually been applied to IC manufacture. As ITRS 2011 Roadmap shows that gate length will shrink to 20 nm in 2013, the industry mainstream manufacturing technologies of the nano-electronics seems moving toward the goal. It is well known that the IC technology development basically depends on material science. In Section 2, some new material and process technologies are highlighted, such as strained silicon, high K and metal gate, ultra-low K, 450 mm silicon wafer, and immersion lithography technologies are the foundation of IC manufacture. The process integration for advanced CMOS manufacture technology is discussed in Section 3. As an example, 20 nm process flow scheme is explained and some comparison is made to the precious generation technology. The main process flow difference between 28 nm technology and 20 nm technology is illustrated and some explanations are presented. In Section 4, 3D system packaging technology is introduced. Some preliminary TSV experimental data made by SMIC are shown. It is expected that 3D TSV Wide I/O would eventually be inevitable in 28 nm production and beyond. In Section 5, the research and development of nonvolatile memory are summarized, such as RRAM, PcRAM and MRAM. Some lab experimental and measurement results from SMIC are demonstrated. It is believed that PcRAM, which is relatively mature technology, mass production will probably come up in the mainland in a few years. In Section 6, a couple of new transistor architectures are introduced and some experimental data are demonstrated, such as local SOI and GAA, and some experimental data are shown. Finally, the comments for domestic R&D strategy in IC area are proposed to future IC R&D direction.

astronomy & astrophysics,physics, multidisciplinary
A Review of System-in-Package Technologies: Application and Reliability of Advanced Packaging

Haoyu Wang,Jianshe Ma,Yide Yang,Mali Gong,Qinheng Wang

DOI: https://doi.org/10.3390/mi14061149

IF: 3.4

2023-05-30

Micromachines

Abstract:The system-in-package (SiP) has gained much interest in the current rapid development of integrated circuits (ICs) due to its advantages of integration, shrinking, and high density. This review examined the SiP as its focus, provides a list of the most-recent SiP innovations based on market needs, and discusses how the SiP is used in various fields. Reliability issues must be resolved if the SiP is to operate normally. Three factors—thermal management, mechanical stress and electrical properties—can be paired with specific examples in order to detect and improve package reliability. This review provides a thorough overview of SiP technology, serves as a guide and foundation for the SiP in package reliability design, and addresses the challenges and potential for further development of this kind of package.

chemistry, analytical,nanoscience & nanotechnology,instruments & instrumentation,physics, applied
A New Stage for Microsystem Integration—the Integrated Development of Integrated Circuits Chips and System-Level Electronic Packaging

MIAO Min,JIN Yu-feng

DOI: https://doi.org/10.19304/j.cnki.issn1000-7180.2021.01.001

2021-01-01

Abstract:More than Moore has become the preferred strategy for integrated circuit and electronic, information and telecommunication hardware industries and therefore has just promoted microsystem technology onto a new stage, whereon the boundary between IC (integrated circuit) chips and system-level electronic package has become increasingly blurred, triggering a fashion of integrated development of two domain. This new stage is now exerting a far-reaching influence on the development of microsystem heterogeneous integration domain. Consequently, based on the personal scientific research practice, the characteristics, connotations and trends are analyzed and inferred in-depth for this whole new IC-package co-development stage, from the perspective of architecture evolution, chip-package co-design strategy, multi-physics co-analysis and co-optimization, and major technical innovations in integrated assembling and manufacturing; in addition, the future applications are prospected and the path of evolution is suggested.
Design Methodology Of Cmos Low Power

Dongyan Hao,Ming Zhang,Wei Zheng

DOI: https://doi.org/10.1109/ICIT.2005.1600620

2005-01-01

Abstract:The growing demand for portable electronic devices has led to an increased emphasis on power consumption within the IC design industry. In this article, according the design flow of VLSI, we present a survey of low power design methodology at five levels such as system, behavioral, architectural, logic and physical levels.
Development of Critical Area Research Method for Integrated Circuits and Its Challenges

张国霞,马佩军,张旭,郝跃

2009-01-01

Abstract:Critical area research method is one of the most important research subjects of design for manufacturability (DFM). The mainstream critical area algorithms were summarized and analyzed. Advantages and limitations in Monte Carlo method,polygon operator method and Voronoi diagram were discussed. In addition,challenges to critical area research for deep submicron ICs using new lithography technology were analyzed and discussed in particular.
Recent Progress of Integrated Circuits and Optoelectronic Chips

Hao Yue,Xiang Shuiying,Han Genquan,Zhang Jincheng,Ma Xiaohua,Zhu Zhangming,Guo Xingxing,Zhang Yahui,Han Yanan,Song Ziwei,Liu Yan,Yang Ling,Zhou Hong,Shi Jiangyi,Zhang Wei,Xu Min,Zhao Weisheng,Pan Biao,Huang Yangqi,Liu Qi,Cai Yimao,Zhu Jian,Ou Xin,You Tiangui,Wu Huaqiang,Gao Bin,Zhang Zhiyong,Origin Quantum Computing Company Limited,Chen Yonghua,Liu Yong,Chen Xiangfei,University of Chinese Academy of Sciences,Wang Xingjun,Zhao Lixia,Zou Xihua,Yan Lianshan

DOI: https://doi.org/10.1007/s11432-021-3235-7

2021-01-01

Science China Information Sciences

Abstract:Integrated circuits(ICs) and optoelectronic chips are the foundation stones of the modern information society. The IC industry has been driven by the so-called "Moore’s law" in the past 60 years, and now has entered the post Moore’s law era. In this paper, we review the recent progress of ICs and optoelectronic chips. The research status, technical challenges and development trend of devices, chips and integrated technologies of typical IC and optoelectronic chips are focused on. The main contents include the development law of IC and optoelectronic chip technology, the IC design and processing technology, emerging memory and chip architecture, brain-like chip structure and its mechanism, heterogeneous integration, quantum chip technology, silicon photonics chip technology, integrated microwave photonic chip, and optoelectronic hybrid integrated chip.
The Construction and Application of IC Design Web-cooperation Research Center

陈玉洁,刘勇,高志强,孙义和

DOI: https://doi.org/10.3969/j.issn.1000-7180.2002.07.007

2002-01-01

Abstract:The first organization that unites IC design and network closely IC Design Web-cooperation Research Center is introduced. Its construction and application are discussed. The center realizes technically sharing of IC design resource and cooperation of IC design members. Furthermore, MPW service is particularly described. The further development of the center is expected. The model of integrating IC design and network to promote the development of IC design is presented.
AI-Driven Innovations in IC Designs: From Planning to Implementation

Pei-Yu Lee,Tung-Chieh Chen

DOI: https://doi.org/10.1109/VLSITSA60681.2024.10546365

2024-04-22

Abstract:This paper delves into the evolving landscape of Artificial Intelligence (AI) techniques within integrated circuit (K‘) design, spanning from design planning to implementation. We will focus on the capabilities of AI integration during the physical design stages, particularly in advanced nodes, because rapid growing design complexity and the shrinking of technology nodes have made physical design become incredibly challenging to achieve design closure and better power, performance, area, schedule (PPAS). Lastly, we will discuss the future challenges and opportunities in physical design optimization that could be resolved with the aid of AI.

Computer Science,Engineering
A new methodology of integrating high level synthesis and floorplanning for nanometer regime design

YF Wang,JI Bian,XL Hong

2005-01-01

Abstract:As silicon CMOS technology is scaled into the nanometer regime, the computer aided design technology is challenged by two major feature: the ever-increasing design complexity of gigascale integration and complicated physical effects inherent from the nanoscale technology[l]. The functional complexity is managed by system level design methodologies and the nanometer physical effects are managed by manufacture-aware design techniques. Because these two challenges are combined closely, the cooperation between high level abstraction of a circuit and physical layout has to be engaged. In this paper, a new methodology which cooperate the higher level abstraction of design (high level synthesis) and basic manufacture aware design phase (floorplanning) together is presented.
Trending IC Design Directions in 2022

Chi-Hang Chan,Lin Cheng,Wei Deng,Peng Feng,Li Geng,Mo Huang,Haikun Jia,Lu Jie,Ka-Meng Lei,Xihao Liu,Xun Liu,Yongpan Liu,Yan Lu,Kaiming Nie,Dongfang Pan,Nan Qi,Sai-Weng Sin,Nan Sun,Wenyu Sun,Jiangtao Xu,Jinshan Yue,Milin Zhang,Zhao Zhang

DOI: https://doi.org/10.1088/1674-4926/43/7/071401

2022-01-01

Journal of Semiconductors

Abstract:For the non-stop demands for a better and smarter society, the number of electronic devices keeps increasing exponentially; and the computation power, communication data rate, smart sensing capability and intelligence are always not enough. Hardware supports software, while the integrated circuit (IC) is the core of hardware. In this long review paper, we summarize and discuss recent trending IC design directions and challenges, and try to give the readers big/cool pictures on each selected small/hot topics. We divide the trends into the following six categories, namely, 1) machine learning and artificial intelligence (AI) chips, 2) communication ICs, 3) data converters, 4) power converters, 5) imagers and range sensors, 6) emerging directions. Hope you find this paper useful for your future research and works.
Review of Chiplet-Based Design: System Architecture and Interconnection

Yafei Liu,Xiangyu Li,Shouyi Yin

DOI: https://doi.org/10.1007/s11432-023-3926-8

2024-01-01

Abstract:Chiplet-based design, which breaks a system into multiple smaller dice (or “chiplets”) and reassembles them into a new system chip through advanced packaging, has received extensive attention in the post Moore’s law era due to its advantages in terms of cost, performance, and agility. However, significant challenges arise in this implementation approach, including the mapping of functional components onto chiplets, co-optimization of package and architecture, handling the increased latency of communication across functions in different dies, the uncertainty problems of fragment communication subsystems, such as maintaining deadlock-free when independently designed chiplets are combined. Despite various design approaches that attempt to address these challenges, surveying these approaches one-after-another is not the most helpful way to offer a comparative viewpoint. Accordingly, in this paper, we present a more comprehensive and systematic strategy to survey the various approaches. First, we divide them into chiplet-based system architecture design and interconnection design, and further classify them based on different architectures and building blocks of interconnection. Then, we analyze and cross-compare each classification separately, and in addition, we present a topical discussion on the evolution of memory architectures, design automation, and other relevant topics in chiplet-based designs. Finally, some discussions on important topics are presented, emphasizing future needs and challenges in this rapidly evolving field.
Design space exploration for 3D integrated circuits

Yuan Xie,Yuchun Ma

DOI: https://doi.org/10.1109/ICSICT.2008.4735042

2008-01-01

Abstract:Three-dimensional integrated circuit (3D IC) is emerging as an attractive option for overcoming the barriers in interconnect scaling, thereby offering an opportunity to continue performance improvements using CMOS technology. 3D IC offers the advantages of high performance, low power, smaller form-factor, and heterogeneous integration benefits. However, to enable the wide adoption of the 3D integration technology, there exist many challenges that need to be addressed. First, cost analysis at the early design stage to help the decision making on whether 3D integration should be used for the application is very critical. EDA design tools are the key to enable effective 3D IC designs; design space exploration at the architecture design is also important to fully take advantages that 3D offers. This article provides a tutorial on the design tools and methodologies to help design space exploration in 3D IC designs.
Design of rapid forming system of digital IC based on EDA platform

Chen Yujie,Zhang Chun

DOI: https://doi.org/10.3969/j.issn.1002-4956.2012.09.029

2012-01-01

Abstract:The digital IC rapid forming system can realize the auto synthesis design of digital IC according to the design source files provided by users,and receive the realization results of chips at various integrated circuit manufacturing processes as a reference for project evaluation by uses.The design and realization of the digital IC rapid forming system are introduced in detail.
Deep submicron trends and implications on electronic design automation

Huazhong Yang,Hui Wang,RunSheng Liu,Chongzhi Fan

1996-01-01

Tien Tzu Hsueh Pao/Acta Electronica Sinica

Abstract:The deep submicron technology is paving the way for a wealth of opportunities for the electronic design automation (EDA). On the other hand, EDA has to face some challenges, and the fast timing simulation and interconnect-driven techniques are the most eye-catching ones. After reviewing the recent advancements in the above-mentioned fields, this paper addresses some imperative problems related to EDA.
New device technologies of integrated circuit in post-Moore era

HUANG Ru,LI Ming,AN Xia,WANG RunSheng,CAI YiMao

DOI: https://doi.org/10.1360/112012-509

2012-01-01

Abstract:With the continuous development of large scale integrated circuit(IC) technology,challenges resulting from short channel effects,quantum tunneling and parasitic effects make it increasingly difficult for conventional microelectronic device technology to fulfill the demand of sustaining progressing of IC technology node,and especially the increasingly serious problem of energy consumption has been the greatest bottleneck in continuing Moore's Law,making it inevitable to take advantage of new device technology in post-Moore's era.Therefore,it has become a hot issue that how to develop nanoscale new devices to meet the future demands of microelectronic industry in different IC applications.In this paper,we introduce new device technologies from viewpoints of new structure,new principle and new material,including FinFET,UTB SOI devices,quasi-SOI devices,MultiGate/Gate-All-Around silicon nanowire devices,super steep sub-threshold swing devices and high mobility channel devices.Advantages,existing problems,potential solutions and application prospect of these devices are analyzed,and a roadmap for new device technology in post-Moore era is discussed.
Digital Design and Simulation Platform for On-board Electronic System

LAN Sheng-chang,ZHAO Dan,XU Guo-dong

2008-01-01

Abstract:Coping with the trend of digital design of satellite,integrating designing,simulation,validation and developing,a digital design and simulation platform for On-Board electronic system was established facing task,function and customers. Based on SoC methodology,taking in current achievement in SoC architecture and abstracting the system as IPs,the platform made simulations and validations upon FPGA,and also system and application software designs.The establishment of the platform has brought the design dramatic agility,strict management,and reduction in risk,design period and expense.

New Development of IC Design Methodology

Recent Advances in Monolithic Integration of Diverse Technologies with Si CMOS

Technology Platform for IC Design in Nano-scale CMOS

Digital Electronic System-on-Chip Design: Methodologies, Tools, Evolution, and Trends

Reconfigurable Designs for Networking Silicon.

Non-probabilistic reliability-based structural design optimization based on the interval analysis method

A Review of System-in-Package Technologies: Application and Reliability of Advanced Packaging

A New Stage for Microsystem Integration—the Integrated Development of Integrated Circuits Chips and System-Level Electronic Packaging

Design Methodology Of Cmos Low Power

Development of Critical Area Research Method for Integrated Circuits and Its Challenges

Recent Progress of Integrated Circuits and Optoelectronic Chips

The Construction and Application of IC Design Web-cooperation Research Center

AI-Driven Innovations in IC Designs: From Planning to Implementation

A new methodology of integrating high level synthesis and floorplanning for nanometer regime design

Trending IC Design Directions in 2022

Review of Chiplet-Based Design: System Architecture and Interconnection

Design space exploration for 3D integrated circuits

Design of rapid forming system of digital IC based on EDA platform

Deep submicron trends and implications on electronic design automation

New device technologies of integrated circuit in post-Moore era

Digital Design and Simulation Platform for On-board Electronic System