Abstract:The performance of graphics processing unit (GPU) systems is improving rapidly to accommodate the increasing demands of graphics and high-performance computing applications. With such a performance improvement, however, power consumption of GPU systems is dramatically increased. Up to 30&percnt; of the total power of a GPU system is consumed by the graphic memory itself. Therefore, reducing graphics memory power consumption is critical to mitigate the power challenge. In this article, we propose an energy-efficient reconfigurable 3D die-stacking graphics memory design that integrates wide-interface graphics DRAMs side-by-side with a GPU processor on a silicon interposer. The proposed architecture is a “3D+2.5D” system, where the DRAM memory itself is 3D stacked memory with through-silicon via (TSV), whereas the integration of DRAM and the GPU processor is through the interposer solution (2.5D). Since GPU computing units, memory controllers, and memory are all integrated in the same package, the number of memory I/Os is no longer constrained by the package’s pin count. We can reduce the memory power consumption by scaling down the supply voltage and frequency of memory interface while maintaining the same or even higher peak memory bandwidth. In addition, we design a reconfigurable memory interface that can dynamically adapt to the requirements of various applications. We propose two reconfiguration mechanisms to optimize the GPU system energy efficiency and throughput, respectively, and thus benefit both memory-intensive and compute-intensive applications. The experimental results show that the proposed GPU memory architecture can effectively improve GPU system energy efficiency by 21&percnt;, without reconfiguration. The reconfigurable memory interface can further improve the system energy efficiency by 26&percnt;, and system throughput by 31&percnt; under a capped system power budget of 240W.

A 10TFLOPS Datacenter-Oriented GPU with 4-Corner Stacked 64GB Memory by the Means of 2.5D Packaging Technology

DaDianNao: A Machine-Learning Supercomputer

Optimizing GPU energy efficiency with 3D die-stacking graphics memory and reconfigurable memory interface

GPU Domain Specialization via Composable On-Package Architecture

Performance Evaluation and Optimization of HBM-Enabled GPU for Data-Intensive Applications.

Optimizing power efficiency for 3D stacked GPU-in-memory architecture

3D Gpu Architecture Using Cache Stacking: Performance, Cost, Power and Thermal Analysis

A 3D SoC Design for H.264 Application with On-Chip DRAM Stacking

Energy-efficient GPU Design with Reconfigurable In-Package Graphics Memory.

Ohm-GPU: Integrating New Optical Network and Heterogeneous Memory into GPU Multi-Processors

A Customized Design Of Dram Controller For On-Chip 3d Dram Stacking

GPU-Based Cuboid Algorithm

DLUX: A LUT-Based Near-Bank Accelerator for Data Center Deep Learning Training Workloads

A Hybrid Gpu/Cpu Fft Library For Large Fft Problems

Bandwidth-Effective DRAM Cache for GPUs with Storage-Class Memory

Dual Buffer Rotation Four-Stage Pipeline for CPU–GPU Cooperative Computing

IBOM: an Integrated and Balanced On-Chip Memory for High Performance GPGPUs

Automatic Data Placement into GPU On-Chip Memory Resources

A 3D Packaging Technology for 4 Gbit Stacked DRAM with 3 Gbps Data Transfer

Using Chiplet Encapsulation Technology to Achieve Processing-in-Memory Functions

Orchestrating Cache Management and Memory Scheduling for GPGPU Applications.