A Comprehensive Review of High-Transmittance Low-Conductivity Material-Assisted Radiant Cooling Air Conditioning: Materials, Mechanisms, and Application Perspectives

Jiaan Gu,Huijun Wu,Jia Liu,Yujie J. Ding,Yanchen Liu,Gongsheng Huang,Xin Xu
DOI: https://doi.org/10.1016/j.rser.2023.113972
2024-01-01
Abstract:Radiant cooling in buildings, as an energy-saving and comfort cooling method, is very promising in creating a green and healthy indoor thermal environment in buildings. However, radiant panels are prone to dew condensation and have low cooling capacity; thus, their application in hot and humid regions is limited. Covering the surface of the radiant cooling panel with a high transmittance low conductivity material (HTLCM), and, separating the air contact surface and the radiating surface, to form a new decoupled radiant cooling technology is an effective way to address the deficient radiant cooling capacity and easy condensation. Radiation heat exchange occurs between the radiant cooling surface and the indoor heat source surface through the HTLCM, while the indoor humid air undergoes convective heat exchange with the higher temperature HTLCM surface. The optical, and thermal properties of the material determine the cooling capacity and condensation resistance (thermal performance) of the radiant cooling air conditioning. This review provides a summary of the research advances in HTLCM-assisted radiant cooling air conditioning (RCAC) in recent years. First, the classification and optical and thermal properties of the currently used HTLCMs for radiant cooling are presented. Second, the heat transfer mechanism of RCAC with HTLCM is introduced. Finally, the research advances in the application of HTLCM-assisted radiant cooling are summarized, and the challenges and future development in this field are provided. The practical engineering application of HTLCM-assisted radiant cooling units in hot and humid regions is highlighted.
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