Numerical and experimental studies on crack nucleation and propagation in thin films
Ali Harandi,Shahed Rezaei,Soheil Karimi Aghda,Chaowei Du,Tim Brepols,Gerhard Dehm,Jochen M. Schneider,Stefanie Reese
DOI: https://doi.org/10.1016/j.ijmecsci.2023.108568
IF: 7.3
2023-06-27
International Journal of Mechanical Sciences
Abstract:The prediction of damage and cracking patterns in ceramic thin films plays a vital role in the optimal design thereof. In this study, we focus on developing a numerical framework to predict fracture in ceramic thin films. For accurate and efficient modeling, the fracture energy and the material strength (ultimate stress) are taken into account by the cohesive phase-field damage model. Moreover, we argue that the orientation of the grain morphology induces a preferential direction for the crack which serves as a weak spot for crack initiation and propagation. A novel equivalent fracture energy is introduced into the formulation to account for the effects of microstructure on the cracking behavior of thin films. On the experimental side, tensile tests on (V,Al)N and (V,Al)(O,N) thin films deposited on ductile substrates are performed. It has been shown that this approach is a fast and efficient tracking tool for determining the mode-I fracture properties. To evaluate the accuracy of the anisotropic cohesive phase-field damage model proposed in this study, the crack patterns and crack density values of two chemically different thin films are compared for both numerical and experimental setups. This work provides new insights into the effect of different material parameters on the damage behavior of thin films. The key parameters can be summarized as the ultimate strength, fracture energy as well as the existing residual stress within the film.
engineering, mechanical,mechanics