Abstract:As one of the mainstream physical implementation methods for quantum computing, superconducting qubit has gained much attention in recent years. However, commonly-used wire-bonding technique for signal transporting between external classical processor and internal qubits in lateral circuit plane cannot support enough number of physical qubits to build up computationally-useful, fault-tolerant, error corrected quantum computer due to signal crosstalk and decoherence effect caused by bonding wire. Therefore, advanced packaging technology in semiconductor industry such as flip-chip has been adopted to replace conventional wire-bonding technique, extending the vertical dimension to further improve the qubit integration density. In this work, we have completely demonstrated a fabrication process of flip-chip bonding scheme which is compatible with superconducting qubits, obtaining high mechanical reliability, satisfying DC/microwave transporting performance and superior bondability without introducing lossy material. Due to cryogenic working requirement of qubit, the constituent materials are required to possess superconducting characteristic, which is uncommon in conventional IC package.Herein, we construct functional test vehicles using 50-μmdiameter microbumps in 100 μm pitch based on Al/TiN/In/Au symmetric flip-chip bonding structure, which is respectively corresponding to RDL, diffusion barrier, bump, and antioxidant layer. Based on above basic structure, we have fabricated daisy chain structure for measurement of DC resistance change during cool-down process, transmission line structure for evaluation of microwave transporting performance and sealing ring structure for hermeticity test.X-Ray, step profiler and confocal microscope system show that high-uniformity bumps are all arranged in correct position without obvious defects and short connection between adjacent bumps. Die shear test is conducted exhibiting an average strength of 12.9 MPa, strong enough for holding and further processing. Cross-section morphology are inspected by FIB and SEM, showing a clearly layered microstructure without obvious defects. Standard helium leak test is carried out using overall 20 sealing ring samples, showing eligible leakage rate based on MIL-STD-883 standard, which opens up possibilities for ultra-high vacuum quantum package which will be probably applied for environmental protection and electromagnetic shield in future 3D packaging architecture of superconducting qubits. Electrical test results show reasonable microwave S21 curve with certain performance of superconducting characteristic within operating frequency range of qubits under cryogenic temperature and shows certain degree of resistance drop during cool-down process. These results have systematically demonstrated the feasibility of implementing scalable superconducting quantum processors in higher integration density through indium-based flip-chip technique.

Design and fabrication of cryogenic multiplexing control chip

Cryogenic Multiplexing Control Chip for a Superconducting Quantum Processor

Overcoming I/O bottleneck in superconducting quantum computing: multiplexed qubit control with ultra-low-power, base-temperature cryo-CMOS multiplexer

Multiplexed quantum transport using commercial off-the-shelf CMOS at sub-kelvin temperatures

Cryogenic Materials and Circuit Integration for Quantum Computers

A cryogenic on-chip microwave pulse generator for large-scale superconducting quantum computing

Cryogenic Control and Readout Integrated Circuits for Solid-State Quantum Computing

A Polar-Modulation-Based Cryogenic Transmon Qubit State Controller in 28 Nm Bulk CMOS for Superconducting Quantum Computing

Design and Fabrication of Integrated Superconducting Isolator-Circulator-isolator Chip

Millikelvin temperature cryo-CMOS multiplexer for scalable quantum device characterisation

On-chip cryogenic multiplexing of Si/SiGe quantum devices

Supercurrent Multiplexing with Solid-State Integrated Hybrid Superconducting Electronics

Quantum Computer Control using Novel, Hybrid Semiconductor-Superconductor Electronics

Indium-based Flip-chip Interconnection for Superconducting Quantum Computing Application

Tunable Coupling Architectures with Capacitively Connecting Pads for Large-Scale Superconducting Multi-Qubit Processors

Tunable-coupling architectures with capacitively connecting pads for large-scale superconducting multiqubit processors

Reconfigurable multiplex setup for high throughput electrical characterisation at cryogenic temperature

A system design approach toward integrated cryogenic quantum control systems

Multiplexed control scheme for scalable quantum information processing with superconducting qubits

Integrated multiplexed microwave readout of silicon quantum dots in a cryogenic CMOS chip

Cryogenic CMOS RF Circuits: A Promising Approach for Large-Scale Quantum Computing