Understanding and Engineering Interfacial Thermal Conductance of Two-Dimensional Materials

Weidong Zheng,Cheng Shao,Qi Wang,Guojun Li,Hongkun Li

DOI: https://doi.org/10.1016/j.surfin.2023.103538

IF: 6.2

2023-01-01

Surfaces and Interfaces

Abstract:The continuing miniaturization and increasing power density of two-dimensional (2D) material electronic devices pose a great challenge for effective thermal management, which is mainly limited by interfacial thermal conductance (ITC) between 2D materials and the underlying substrates. Over the past two decades, great experimental and computational advances have been achieved for measuring and understanding heat transport across 2D material interfaces. In this review, we conduct a comprehensive and critical examination to summarize and discuss the advances and issues of ITC of 2D materials. We first introduce the theoretical concepts of ITC and emphasize the assumptions adopted in prior studies for 2D material interfaces. We then review the experimental and computational techniques frequently employed in the determination of ITC of 2D materials. Moreover, we critically discuss the recent developments in understanding interfacial heat transport mechanisms of 2D materials from two aspects, i.e., general routes to tune heat transport across interfaces of 2D materials and novel interfacial heat transport phenomena. Importantly, we unambiguously present and analyze the discrepancies in prior studies by thoroughly compiling the reported experimental and computational values of ITC of various 2D material interfaces. Finally, we make a summary and discuss the directions and avenues for future research.