Abstract:A simple and readily applicable voltammetric approach is described to characterize and measure the site-hopping surface diffusion of underpotential-deposited (UPD) metal adatoms at nanoelectrodes. UPD refers to the deposition of atoms on foreign metal supports at potentials lower than those predicted by Nernst law for a bulk deposition. Despite its importance in several fields of catalysis, advanced nanofabrication or even atomic nanoengineering by atomic layer epitaxy, diffusion of UPD adatoms is difficult to observe at micro- and macroelectrodes. In fact, at electrodes of usual dimensions, UPD adatoms surface diffusion is masked by other electrochemical phenomena of greater relative amplitudes. Conversely, at nanowires electrodes sealed in glass, only an extremely small fraction of the surface of the wires is exposed to the electrolyte solution and is rapidly loaded. This allows the spillage of UPD adatoms onto the much larger area of the nanowire rod which is immune to Faradaic reactions due to its isolation from the electrochemical solution by the glass casing. Therefore, surprisingly for a UPD process, voltammetric peaks currents and integral desorption charges primarily reflect these diffusional surface processes so that the integral charges vary linearly with the inverse of the square root of the scan rate. This is easily observable and measurable with usual bench-level electrochemical instrumentation. In this work, by using nanoelectrodes with diameters between 90 and 260 nm, we were able to establish the major involvement of this site-hopping surface diffusion of UPD Pb adatoms on polycrystalline gold (Au) and characterize it quantitatively. The equivalent surface diffusion coefficient of UPD Pb adatoms was determined to be similar to 4.4x10(-11) cm(2) s(-1) at room temperature, corresponding to a Gibbs free energy activation barrier of ca. 18.72 kJ mol(-1) (i. e., 0.19 eV per Pb adatom) for the reaction of inter-sites exchange of Pb adatoms on a polycrystalline Au surface.

Investigation of Copper Underpotential Deposition on Polycrystalline Gold Electrodes

Technique for Determination of Gold Electrode Area and Its Application of Characterization in Self-Assembling Process

Surface Plasmon Resonance Coupled with Potential‐step Chronoamperometry: Theory and Applications for Quantitative Measurements of Electrodeposited Thin Films

Effects of Anions on the Underpotential Deposition Behavior of Cu on Polycrystalline Pt

Surface Diffusion of Underpotential‐Deposited Lead Adatoms on Gold Nanoelectrodes

Study on Underpotential Deposition of Manganese by Density Functional Calculation and Cyclic Voltammetry

In Depth Analysis of Complex Interfacial Processes: in Situ Electrochemical Characterization of Deposition of Atomic Layers of Cu, Pb and Te on Pd Electrodes

Unconventional Electrochemical Behaviors of Cu Underpotential Deposition in a Chloride-Based Deep Eutectic Solvent: High Underpotential Shift and Low Coverage.

Copper Metallization of Gold Nanostructure Activated Polypyrrole by Electroless Deposition

Investigations Of The Selective Enrichment Of Cu2+, On Gold Electrode By Electroless Deposition

Study on the Electrodeposition of Lead with In-Situ Ellipsometry

Atomic layer-by-layer construction of Pd on nanoporous gold via underpotential deposition and displacement reaction

The Study of Pt@Au Electrocatalyst Based on Cu Underpotential Deposition and Pt Redox Replacement

Self-assembling Process of Alkanethiol Monolayers on Gold Surface Via Underpotential Deposition

Progress of Research on Underpotential Deposition--II. Research Techniques and Application of Underpotential Deposition

Investigation of the Effect of Electrodeposited Cu from Graphite Wrapped in Polypyrrole Film Formed by Chemical Oxidation

Investigation Of Underpotential Deposition Of Lead On Rotating Silver Disk Electrode By Chronocoulometry

Underpotential deposition of Cu onto Au(111) in the presence of acetate

A Voltammetric Study of the Underpotential Deposition of Cobalt and Antimony on Gold

Copper Deposition on Au(111) in a Deep Eutectic Solvent: An In Situ STM Study**

Underpotential Deposition of Tin(ii) on a Gold Disc Electrode and Determination of Tin in a Tin Plate Sample