Abstract:Metal fill insertion has become an essential step to reduce dielectric thickness variation and improve pattern uniformity, which is important in mitigating process variations, thereby achieving better manufacturing yield. However, metal fills could induce coupling capacitance, which is not often considered in existing works that typically focus more on pattern density uniformity, incurring significant problems in timing closure. In this paper, we address the timing-aware fill insertion problem that considers the total capacitance and density constraints simultaneously. First, initial metal fill insertion and design-rule-aware legalization are used to quickly obtain an initial fill insertion solution. Second, from critical conductors to powers/grounds in a circuit, we divide conductors into different equivalent paths and then construct a capacitance graph to globally reduce the capacitance of each equivalent path. Third, we present a density-aware coupling capacitance optimization method and a fast Monte Carlo based fill selection to further reduce the coupling capacitance between any pair of conductors. Finally, we present a density-aware fill deletion method to reduce the fill amounts. We evaluate the performance of our algorithm based on the benchmarks of the 2018 CAD Contest at ICCAD and its official contest evaluator. Compared with the first place team of the contest and the state-of-the-art work, experimental results show that our algorithm achieves the lowest total capacitance and the least fill amount for each benchmark.

Toward Optimal Filler Cell Insertion with Complex Implant Layer Constraints.

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A novel layout automation flow to facilitate test chip design for standard cell characterization

High Performance Dummy Fill Insertion with Coupling and Uniformity Constraints

Effective Analytical Placement for Advanced Face-to-Face-Bonded Circuit Designs.

A New Timing-Driven Placement Algorithm Based on Table-Lookup Delay Model

An Efficient EPIST Algorithm for Global Placement with Non-Integer Multiple-Height Cells

Performance Aware Dummy Fill Insertion

Dummy Fill Aware Buffer Insertion After Layer Assignment Based On An Effective Estimation Model

NeurFill: Migrating Full-Chip CMP Simulators to Neural Networks for Model-Based Dummy Filling Synthesis

Provably Good and Practically Efficient Algorithms for CMP Dummy Fill.

A Multilevel Analytical Placement for 3D ICs

Ipf: In-Place X-Filling Algorithm for the Reliability of Modern Fpgas

Optimization of innovative approaches to the shortening of filling times in 3D integrated through-silicon vias (TSVs)