Abstract:Dummy filling is widely applied to significantly improve the planarity of topographic patterns for the chemical mechanical polishing (CMP) process in VLSI manufacturing. In the dummy filling flow, dummy synthesis works as the key step to adjust the post- CMP profile height. However, existing dummy synthesis optimization approaches usually fail to balance the filling quality and efficiency. This article proposes a novel model-based dummy filling synthesis framework NeurFill, integrated with multiple starting points-sequential quadratic programming (MSP-SQP) optimization solver. Inside this framework, a full-chip CMP simulator is first migrated to the neural network, achieving $8134\times $ speedup on gradient calculation by backward propagation. Entrenched in the CMP neural network models, we further implement an improved version of NeurFill (pNeurFill) to alleviate the post- CMP height variation caused by dummy perimeter. After each iteration of dummy density optimization, an additional perimeter adjustment based on a given candidate dummy pattern set is applied to search for the optimal perimeter fill amount. The experimental results show that the proposed NeurFill outperforms existing rule- and model-based methods. The extra perimeter adjustment strategy in pNeurFill can achieve an average 66.97Å decreasing in height variation and 8.92% quality improvement compared to NeurFill. This will provide guidance for DFM so as to increase IC chip yield.

A Novel and Unified Full-Chip CMP Model Aware Dummy Fill Insertion Framework with SQP-Based Optimization Method

A Novel Unified Dummy Fill Insertion Framework With Sqp-Based Optimization Method

Pneurfill: Enhanced Neural Network Model-Based Dummy Filling Synthesis with Perimeter Adjustment

NeurFill: Migrating Full-Chip CMP Simulators to Neural Networks for Model-Based Dummy Filling Synthesis

Provably Good and Practically Efficient Algorithms for CMP Dummy Fill.

Performance Aware Dummy Fill Insertion

Efficient Approximation Algorithms for Chemical Mechanical Polishing Dummy Fill

Dummy Fill Aware Buffer Insertion After Layer Assignment Based On An Effective Estimation Model

High Performance Dummy Fill Insertion with Coupling and Uniformity Constraints

Chip-level CMP Modeling and Smart Dummy for HDP and Conformal CVD Films

An Efficient Method for Gradient-Aware Dummy Fill Synthesis

A Fast OPC Algorithm for IC Layout Based on 1-D Cells after Optimization of Gap Distribution

Dummy Fill Aware Buffer Insertion During Routing

Model Based Layout Pattern Dependent Metal Filling Algorithm for Improved Chip Surface Uniformity in the Copper Process

Complete DFM Model for High-Performance Computing SoCs with Guard Ring and Dummy Fill Effect

CMP Fill Synthesis: A Survey of Recent Studies

A Layout Optimization Method to Reduce Commutation Inductance of Multi-Chip Power Module Based on Genetic Algorithm

Embedded MPC Controller Based on Interior‐Point Method with Convergence Depth Control

Optimization of Graphical Parameter Extraction Algorithm for Chip-Level CMP Prediction Model Based on Effective Planarization Length

Underfill of flip chip on laminates: simulation and validation

Toward Optimal Filler Cell Insertion with Complex Implant Layer Constraints.