Abstract:High-voltage and fast-switching silicon carbide (SiC) power modules are needed to construct high-voltage and high power-density converters. Stacking multiple low-voltage SiC devices to increase the equivalent blocking voltage shows advantages in on-state resistance, current capacity, and cost over one single high-voltage device. An indirect series-connected SiC MOSFET power module using quasi-two-level hybrid-clamp topology is proposed in this article. The voltages across the devices are automatically balanced with an open-loop modulation strategy to avoid sensors and control algorithm. Moreover, only ceramic capacitors are needed besides the MOSFETs and diodes in the topology. Thanks to this, the topology was highly integrated into a power module using SiC dies, which is equivalent to a general-purpose two-level medium-voltage SiC MOSFET power module. The switching losses of the power module show advantages over other stacking methods and even a single high-voltage switch and it can be evaluated with a two-level half-bridge (HB). To achieve this, the automatic voltage-balancing performance is analyzed in detail and the parasitic output capacitance in the topology is investigated, based on which the design considerations are presented. The simulation results from LTspice confirm the voltage-balancing and a 3600V/20A HB power module is built in the lab and the experimental results verify the design.

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