Low-Temperature Self-Stacking Ink for Electrohydrodynamic Direct Writing

Xianruo Du,Yisheng Zhong,Guoyi Kang,Jiaxin Jiang,Xiang Wang,Wenwang Li,Gaofeng Zheng
DOI: https://doi.org/10.1021/acsapm.3c00723
2023-01-01
ACS Applied Polymer Materials
Abstract:Flexible electronics have gained significant attentionin variousfields due to their widespread applications in production and dailylife. The electrohydrodynamic direct writing (EDW) is a promisingmethod for fabricating flexible electronics due to its high efficiency,low cost, and ability to produce high-resolution patterns. However,traditional metal-based inks used in the EDW often suffer from agglomerationand needle blockage, which negatively impacts the direct writing effect,especially on flexible substrates. To address these issues, this studyproposes a particle-free ink formulation that is simple to prepareand exhibits excellent performance. Polyethylene oxide is a long-chainpolymer, and its aqueous solution is a non-Newtonian fluid, whichis often used as a thickener and complexing agent for inks. The inkis prepared using a one-pot method based on the silver-amine complexationmechanism, which enables low-temperature sintering without metal particleagglomeration. The fibers fabricated from the ink exhibit a remarkablesintering performance, achieving a resistance of 3.00 k & omega;/cmat low temperature of 50 & DEG;C. Additionally, the ink produces fiberswith self-stacking properties that can be utilized to control theresistance of the fiber. Overall, this ink formulation has significantpotential for the preparation of flexible electronics.
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