Abstract:The advent of three-dimensional stacked chips has significantly enhanced overall performance but introduced challenges in thermal analysis. To ensure the reliable operation of stacked chips and improve the design efficiency of heat sinks, a comprehensive exploration of thermal management issues, the formulation of practical thermal design principles, and the development of a foundational heat transfer analysis model are imperative. In this study, a three-dimensional stacked module is modeled using FloTHERM finite element simulation technology, and its temperature profile is subsequently simulated. The thermal resistance value of the module's shell is calculated to be 37.25 °C W −1 . Subsequently, utilizing the instantaneous state dual interface method, the junction-to-case thermal resistance of the module is experimentally measured using T3ster equipment. Two identical modules are tested, revealing a junction-to-case resistance value of 39.45 °C W −1 for module No. 1 and 40.50 °C W −1 for module No. 2—both approximately 40 °C W −1 , thereby validating the accuracy and repeatability of the tests. A comparative analysis between the simulated and experimental thermal resistance values indicates an error of approximately − 5.5% for module 1 and − 8.0% for module 2. Further analysis suggests potential sources of error, such as thermal conductivity of the plastic packaging material and hot spot distribution. The paper concludes with simulation-based analyses of plastic packaging material thermal conductivity and hot spot distribution, offering insights for refining the simulation model. This study verifies the correctness of the results obtained by using finite element analysis to build a model for thermal simulation analysis. It has reference value for the thermal simulation analysis and thermal resistance test method of 3D integrated package module.

Thermal Interface Modeling and Experiments with Novel Multi-layer Structure in Modular Microsatellite

Thermal Control of Modular Microsatellites: Technologies and Techniques

Simulation, Experimentation, and Collaborative Analysis of Adjacent Heat Exchange Modules in a Vehicular Cooling System

Thermal Analysis Modeling and On-orbit Temperature Prediction for a Microsatellite with Multilayer Insulation

Numerical Modeling of the Performance of Thermoelectric Module with Polydimethylsiloxane Encapsulation

A Thermal Network Model for Multichip Power Modules Enabling to Characterize the Thermal Coupling Effects

Numerical Simulation of Thermoelectric Based Temperature Control System for CubeSat in Space.

Simulation of thermal field of satellite on orbit influenced by multilayer insulation material

Solid Chamber for Satellite Electronic Modules and Evaluation of Its Heat Conduction Behavior

Design and Analysis of a Hollow Metallic Microlattice Active Cooling System for Microsatellites

Exploring modeling and testing approaches for three-dimensional integrated thermal resistance of chiplets

Design and Simulation for Thermal Control System of Nanosatellite

Satellite MEMS Thermal Control System Dynamic Characteristics and Autonomous Thermal Control Strategy

Study of Response Surface Methodology in Thermal Optimization Design of Multichip Modules

Modeling and Analysis of Mems-Based Cooling System for Nano-Satellite Active Thermal Control

A Fast Steady-state Thermal Modeling of Power Modules Based on Fourier Analytic Series

Thermal Analysis and Research of Multi-Chip Component Substrate Based on Different Thermal Conductivity Models

Parametric Study in Thermal Optimization Design of Multi-Chip Module

Multi-scale simulation and optimization on a thermal management system of intermediate circuit and experiment validation

Modeling and Implementation of Multilayer Insulation for Small-Scale Ultrahigh Temperature Systems

Numerical Simulation and Analysis for a New Thermal Conduction Scheme in Chip-on-Chip SiP