Wafer Level Self-Assembly of Microstructures Using the Global Magnetic Lifting and Localized Induction Welding

Hsueh-An Yang,Chang-Yi Lin,Weileun Fang
DOI: https://doi.org/10.1109/sensor.2005.1496614
2005-01-01
Abstract:This study has successfully demonstrated a process to localize assembly and weld microstructures using an external magnetic field. The primary three merits of this technology are: (1) the magnetic field is used not only to assemble the microstructures but also to fix them by induction welding; (2) the assembly and welding can be localized by the magnetic film; a global wafer level process can also be achieved by the magnetic field; (3) it is easy to tune the heating temperature by varying the area of magnetic film; in other words, the photolithography can define various temperature regions on the substrate.
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