Improved Breakdown Strength and Energy Density of All-Organic Polymer Dielectrics at Elevated Temperature

Q.-K. Feng,S.-L. Zhong,L.-J. Yin,J.-Y. Pei,Y.-X. Zhang,Y.-H. Song,Z.-M. Dang
DOI: https://doi.org/10.1049/icp.2022.0173
2021-01-01
Abstract:Polymer dielectrics with high breakdown strength and energy density at high temperature conditions are critical for film capacitors. In this work, all-organic composite films are prepared by thermoplastic polyurethane (TPU) and poly(vinylidene fluoride-co-hexafluoropropylene) (P(VDF-HFP)), and the dielectric as well as energy storage properties at elevated temperature conditions are investigated. It is found that the dielectric constant and dielectric loss of TPU/P(VDF-HFP) decrease with the introduction of organic TPU filler. Due to the improved breakdown strength of 235 MV/m at elevated temperature, the TPU-1 vol%/P(VDF-HFP) composite film shows 82% higher discharged energy density compared with neat P(VDF-HFP). The low dielectric loss, high breakdown strength, high electrical resistant, high discharged energy density and charge-discharge efficiency of TPU/P(VDF-HFP) film make it potentially to be utilized in the field of high temperature capacitive energy storage applications.
What problem does this paper attempt to address?