The Influence of Degassing Time and Curing Time on Insulation Behaviours of Silicone Gel in IGBT Modules

K. Li,B. Zhang,X. Li,H. Ke
DOI: https://doi.org/10.1049/icp.2022.0149
2021-01-01
Abstract:The silicone gel is used to encapsulate insulated gate bipolar transistor (IGBT) modules. It can prevent electrical discharges and protect semiconductors against humidity, dust, and vibration. The silicone gel has to be processed through mixing, degassing and curing. These procedures will affect the insulation behaviours of silicone gel, including the degassing time and curing time. Partial discharge (PD) and electrical tree, which are warning signals of insulation failure, appear at different voltages when processing conditions are changed. However, the way how these conditions affect phenomena is not clear. Therefore, this paper investigates the influence of processing conditions on partial discharge and electrical tree. The experimental study is conducted by needle-plate electrodes under AC voltage. The results demonstrate that the degassing time has a positive influence on the insulation performance, while the curing time makes a little positive effect on insulation behaviours. And the article also suggests a suitable operating procedure which insulation behaviours need.
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