Abstract:Non-volatile memory (NVM) based computing-in-memory (CIM) shows significant advantages in handling deep learning tasks for artificial intelligence (AI) applications. To overcome the decreasing cost effectiveness of transistor scaling and the intrinsic inefficiency of data-shuttling in the von-Neumann architecture, CIM is proposed to realize high-speed and low-power system with parallel multiplication accumulation (MAC) computing [1] [2]. However, current demonstrations are mainly based on single macro and present limited computing parallelism. Realizing a fully-integrated CIM chip with a complete neural network model is still missing. The major challenges lie in: (1) The IR drop and transient errors when carrying out MAC operations in non-volatile memory arrays decrease the computing accuracy and further limit the parallelism; (2) The inefficiency of the interface blocks between different arrays due to the power overhead of the A/D and D/A converters (shown in Fig. 33.2.1). To address these challenges, this work proposes: (1) A sign-weighted 2T2R (SW-2T2R) array to reduce IR drop by decreasing the accumulative SL current (ISL), and eventually boost the computing parallelism; (2) a low-power interface design with resolution-adjustable LPAR-ADC to realize flexible tradeoff between system accuracy and power consumption. In this manner, this work implements a fully-integrated 784-100-10 MLP model on an integrated CIM chip with158.8kb analog ReRAMs. This chip realizes high recognition accuracy (94.4%) on MNIST database, high inference speed (77 µs/lmage), and 78.4 TOPS/W peak energy efficiency. The CMOS circuits are fabricated in a 130nm process.

A Heterogeneous Microprocessor Based on All-Digital Compute-in-Memory for End-to-End AIoT Inference

A Robust 8-Bit Non-Volatile Computing-in-Memory Core for Low-Power Parallel MAC Operations.

An 8-Bit in Resistive Memory Computing Core with Regulated Passive Neuron and Bitline Weight Mapping

A Low-Power In-Memory Multiplication and Accumulation Array with Modified Radix-4 Input and Canonical Signed Digit Weights

Neural Network Acceleration and Voice Recognition with a Flash-based In-Memory Computing SoC

A Heterogeneous Microprocessor for Intermittent AI Inference Using Nonvolatile-SRAM-based Compute-In-Memory

NS-CIM: A Current-Mode Computation-in-Memory Architecture Enabling Near-Sensor Processing for Intelligent IoT Vision Nodes.

A Heterogeneous In-Memory Computing Cluster For Flexible End-to-End Inference of Real-World Deep Neural Networks

A 2.75-to-75.9tops/w Computing-in-Memory NN Processor Supporting Set-Associate Block-Wise Zero Skipping and Ping-Pong CIM with Simultaneous Computation and Weight Updating.

NS-Engine: Near-Sensor Neural Network Engine with SRAM-Based Compute-in-Memory Macro

A 28-Nm 135.19 TOPS/W Bootstrapped-SRAM Compute-in-Memory Accelerator with Layer-Wise Precision and Sparsity

An Energy-Efficient Computing-in-Memory NN Processor with Set-Associate Blockwise Sparsity and Ping-Pong Weight Update

A 28-Nm 36 Kb SRAM CIM Engine with 0.173 $\mu $m$^{2}$ 4T1T Cell and Self-Load-0 Weight Update for AI Inference and Training Applications

Energy-efficient SNN Architecture using 3nm FinFET Multiport SRAM-based CIM with Online Learning

AIMMI: Audio and Image Multi-Modal Intelligence Via a Low-Power SoC with 2-Mbyte On-Chip MRAM for IoT Devices

ReDCIM: Reconfigurable Digital Computing- in -Memory Processor with Unified FP/INT Pipeline for Cloud AI Acceleration

A 41.7TOPS/W@INT8 Computing-in-Memory Processor with Zig-Zag Backbone-Systolic CIM and Block/Self-Gating CAM for NN/Recommendation Applications

A CIM-Digital Heterogeneous Accelerating System with Analog Interconnection for Neural Networks

TensorCIM: Digital Computing-in-Memory Tensor Processor with Multichip-Module-Based Architecture for Beyond-NN Acceleration

A 64-core mixed-signal in-memory compute chip based on phase-change memory for deep neural network inference

33.2 A Fully Integrated Analog ReRAM Based 78.4TOPS/W Compute-In-Memory Chip with Fully Parallel MAC Computing.