Experimental characterization methods for thermal contact resistance: A review
Yaoqi Xian,Ping Zhang,Siping Zhai,Peng Yuan,Daoguo Yang
DOI: https://doi.org/10.1016/j.applthermaleng.2017.10.163
IF: 6.4
2018-02-01
Applied Thermal Engineering
Abstract:Thermal contact resistance (TCR) plays an importance role in thermal management, which can strongly affect heat dissipation across interfaces, especially as devices are becoming smaller and smaller in size. This paper presents a review of commonly used experimental characterization methods for TCR including the steady-state method, the T-type method, micro-thermometry, Raman-based techniques, infrared thermography measurements, laser-flash measurements, photoacoustic techniques, the 3ω method and transient thermoreflectance techniques. Conventional steady-state measurements are still an acknowledged technique for measuring TCR for bulk materials, and recent modifications and improvements are increasing their measurement accuracy and reliability. Transient methods are diverse and widely applied to both bulk and low dimension materials. We describe in detail the principles and developments of both the steady-state and transient methods and summarize new applications for different material level and the features of each test methodology for TCR. Finally, we discuss the challenges facing TCR characterization and identify possible future research directions.
energy & fuels,engineering, mechanical,thermodynamics,mechanics